Wafer Temperature Control with Disturbance-Based Sensor Switching
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Solution Overview
Problem
Existing temperature control devices for wafers take time to adjust to a target temperature after local heat disturbance and may experience overshooting when switching temperature sensors.
Innovation Solution
A temperature control device with a mounting unit partitioned into areas, each equipped with independent temperature adjusting units and sensors, a disturbance detecting unit, and a switching mechanism that feeds temperature feedback from affected areas to adjust temperatures rapidly and prevent overshooting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature sensor switching is performed when disturbance position changes, then temperature control coverage is maintained, but overshooting occurs during PID control adjustment
Solution Approach 1:
The system performs preliminary detection of disturbance application positions using the disturbance detecting unit before switching temperature sensors. This allows the control system to prepare appropriate sensor selections in advance, preventing overshooting during sensor switching while maintaining continuous temperature control coverage across all wafer areas
Solution Approach 2:
The disturbance detecting unit provides feedback information about disturbance application positions to the temperature control unit. This feedback mechanism enables the system to selectively use temperature sensors based on actual disturbance conditions, maintaining control precision while avoiding overshooting during sensor transitions
2Stability of the object's composition
If conventional temperature control is used after local heat disturbance, then temperature stability is maintained, but adjustment time to target temperature is excessive
Solution Approach 1:
The disturbance detecting unit performs preliminary detection of heat disturbance application positions and activates the appropriate temperature sensors before full temperature adjustment is needed. This preliminary action enables the system to start temperature correction processes earlier and more efficiently, reducing overall adjustment time while maintaining stability
Solution Approach 2:
The system dynamically selects and switches between different temperature sensors based on real-time disturbance detection results. This dynamic adaptation allows the temperature control system to respond more quickly to localized disturbances and adjust temperatures faster to target values while maintaining stability through continuous monitoring
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid temperature adjustment to a target temperature after local heat disturbance and curbs overshooting by selectively using temperature feedback from affected areas.
Implementation Method 1
a plurality of temperature sensors provided in each of the plurality of areas and configured to detect the temperature of the corresponding area
Implementation Method 2
a temperature adjusting unit configured to heat or cool the mounting unit
Data Source
AI summary
A temperature control device for a wafer includes: a mounting unit in which a mounting surface on which a wafer is mountable is partitioned into a plurality of areas; a temperature adjusting unit configured to adjust temperatures of the plurality of areas; temperature sensors configured to detect the temperatures of the plurality of areas; a temperature control unit configured to control the temperatures of the plurality of areas; a disturbance detecting unit configured to detect application of disturbance to the corresponding area; and a switching unit configured to feed only the detected temperature of the temperature sensor provided in the area to which application of disturbance has been detected back to the temperature control unit. The temperature adjusting unit adjusts the temperatures of the plurality of areas on the basis of the detected temperature fed back by the switching unit.