Temporary Adhesion Method for Thin Wafer Processing
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Solution Overview
Problem
Existing temporary adhesion methods for wafers are inadequate for forming uniform films on heavily stepped substrates, lack compatibility with TSV and wiring formation, and have limited thermal resistance and productivity in semiconductor processing.
Innovation Solution
A temporary adhesion method using a combination of a non-silicone thermoplastic resin layer and a thermosetting polymer layer, with specific storage modulus and tensile rupture strength properties, to facilitate uniform film formation, high thermal resistance, and easy separation, enhancing compatibility with TSV and wiring processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single-layer adhesive material is used, then the process is simple, but it cannot provide both strong adhesion and uniform film formation on heavily stepped substrates
Solution Approach 1:
The adhesive material is divided into two functional layers: a first adhesive layer (silicone-based) that provides strong adhesion to the substrate, and a second adhesive layer (non-silicone thermoplastic resin) that forms a uniform film on the heavily stepped surface. This segmentation allows each layer to specialize in one function, resolving the contradiction between adhesion strength and film uniformity.
Solution Approach 2:
The invention uses a composite adhesive structure combining silicone-based adhesive material and non-silicone thermoplastic resin in a layered configuration. This composite approach leverages the complementary properties of both materials: silicone for strong bonding and thermoplastic resin for conformal coating on uneven surfaces.
2Ease of manufacture
If conventional adhesive materials are used, then the process is simple, but thermal stability is insufficient at temperatures exceeding 200°C
Solution Approach 1:
The invention changes the chemical composition parameters of the adhesive material by introducing a non-silicone thermoplastic resin layer with specific glass transition temperature and melting point properties. This layer provides thermal stability above 200°C while maintaining ease of application through thermoplastic characteristics, resolving the contradiction between process simplicity and thermal stability.
3Strength
If a highly crosslinked adhesive is used, then adhesion strength is high, but the adhesive becomes brittle and causes cracks during lamination
Solution Approach 1:
The adhesive system is segmented into two layers with different mechanical properties: the first layer (silicone-based) provides strong adhesion, while the second layer (non-silicone thermoplastic resin) provides flexibility and crack resistance during lamination. This segmentation allows the system to achieve both high strength and high toughness.
Solution Approach 2:
Different regions of the adhesive structure have different local qualities: the silicone-based layer near the substrate provides strong bonding, while the non-silicone thermoplastic resin layer on the outer surface provides flexibility and resistance to cracking during subsequent lamination processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables the formation of a uniform thin wafer with improved thermal resistance and productivity, allowing for stable processing and easy separation without defects, thus increasing the efficiency and yield of semiconductor manufacturing.
Implementation Method 1
adhesively bonding the thermoplastic resin layer (A) and the thermosetting polymer layer (B) by heat curing the thermosetting polymer layer (B)
Implementation Method 2
forming the thermoplastic resin layer (A) on the front surface of the wafer from a liquid composition (A') containing a thermoplastic resin, forming the thermosetting polymer layer (B) on the support by laminating a film resin (B') that has been formed from a composition containing a thermosetting polymer, and then heating the wafer and the support under reduced pressure
Data Source
Figure 1
AI summary
The present invention is a temporary adhesion method for temporarily bonding a support (3) and a wafer (1) via a temporary adhesive material (2), including attaching the wafer to the support via the temporary adhesive material including a complex temporary adhesive material layer that consists of a thermoplastic resin layer (A) exhibiting a storage modulus E' of 1 to 500 MPa and a tensile rupture strength of 5 to 50 MPa at 25°C and a thermosetting polymer layer (B) exhibiting a storage modulus E' of 1 to 1000 MPa and a tensile rupture strength of 1 to 50 MPa at 25°C after curing, wherein the attaching is performed by forming the layer (A) on the front surface of the wafer from a liquid composition (A'), forming the layer (B) on the support by laminating a film resin (B'), and then heating the wafer and the support under reduced pressure, or forming the layer (A) on the front surface of the wafer from the liquid composition (A'), forming the layer (B) on the layer (A) by laminating the film resin (B'), and then heating the wafer and the support under reduced pressure, and heat curing the layer (B). This temporary adhesion method facilitates temporary adhesion and separation and can increase productivity of thin wafers.