Temporary Bonding Method for Wafers with Raised Components

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for temporary bonding of thin objects, such as wafers with raised electronic components, face challenges in achieving sufficient adhesion without the glue layer interfering with handle separation, particularly when the glue thickness is excessive.

Innovation Solution

A method involving a two-step adhesive film system where the first adhesive film with a thicker glue layer bonds the object to a handle, and a second adhesive film with a thinner glue layer bonds the first film, allowing for handle removal without glue contact, and includes steps like thinning the object, cutting the adhesive film, and chemical etching to ensure proper separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the glue layer thickness is increased to encapsulate raised portions, then adhesion is improved, but the glue contacts the handle and prevents separation

Engineering Contradiction:

ImproveadhesionVSAvoidseparation

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The adhesive system is divided into two separate adhesive films, each performing a distinct function. The first adhesive film bonds the object to the handle with sufficient thickness to encapsulate raised portions, while the second adhesive film bonds the first film to the frame without contacting the handle, enabling successful separation

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first adhesive film acts as an intermediary layer between the object and the handle, providing the necessary adhesion and encapsulation of raised portions. The second adhesive film serves as an intermediary between the first adhesive film and the frame, completing the bonding system without interfering with handle separation

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables effective temporary bonding and subsequent separation of the handle from the object while protecting raised electronic components, ensuring reliable adhesion and preventing glue interference during handle removal.

Implementation Method 1

bonding the object to a handle on the side of the first surface, bonding the object to a first adhesive film on the side of the second surface

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

the step of removal of the portions of the first glue layer in contact with the handle comprises a chemical etch step

Methodology Applied

Scientific EffectChemical etching: Chemical Bonding

Data Source

PatentUS11569115B2Temporary bonding method

Publication Date: 2023.01.31 COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

AI summary

A method of temporary bonding of an object having first and second opposite surfaces successively including bonding the object to a handle on the side of the first surface, bonding the object to a first adhesive film on the side of the second surface, bonding the first adhesive film to a second adhesive film on the side opposite to the object, and removing the handle from the object.