Wafer-Level Test Module for I/O Redistribution and Reliable Contact

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Solution Overview

Problem

Current testing methods for semiconductor devices in fan-out wafer level chip scale packages (WLCSPs) are inefficient in identifying functional defects and performance characteristics, particularly due to limitations in redistributing I/O pads and ensuring reliable electrical connections.

Innovation Solution

A testing module with a circuit board structure, connectors, and connecting structures that redistribute electrical signals efficiently across the semiconductor wafer-form package, utilizing a combination of connectors and elastic elements to ensure proper contact and heat dissipation, allowing for effective testing of semiconductor devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional testing methods are used for semiconductor devices in fan-out wafer level chip scale packages, then the testing process is simple, but the efficiency in identifying functional defects and performance characteristics is insufficient

Engineering Contradiction:

Improvetesting efficiencyVSAvoidtesting module complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The testing module is divided into multiple independent components including circuit board structures, connectors, and connecting structures. Each component performs a specific function in the testing process, allowing for modular assembly and improved testing efficiency without requiring a complete redesign of the entire testing system.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The circuit board structure serves multiple functions: it provides mechanical support, establishes electrical connections through connectors, and enables signal transmission for comprehensive testing. This multi-functionality reduces the need for separate dedicated components for each testing function, thereby improving productivity while managing complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If the number of I/O pads on semiconductor dies is increased, then more comprehensive testing is enabled, but the redistribution of I/O pads becomes more difficult

Engineering Contradiction:

Improvetesting coverageVSAvoidI/O pad redistribution

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Connectors serve as intermediary components that facilitate the redistribution and connection of I/O pads. These connectors provide intermediate connection points that simplify the routing and distribution of electrical signals to multiple I/O pads, making it easier to achieve comprehensive testing coverage without directly complicating the semiconductor die fabrication process.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If comprehensive electrical connections are established for testing, then reliable signal transmission is achieved, but the complexity of the testing module increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidtesting module structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

Multiple electrical connection functions are merged into integrated circuit board structures and connecting structures. These combined components simultaneously provide mechanical support, electrical connectivity, and signal transmission pathways, thereby achieving reliable electrical connections while reducing the overall structural complexity compared to using separate components for each function.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables efficient identification of defects and performance evaluation of semiconductor devices by ensuring reliable electrical connections and heat management, thereby improving the testing process for fan-out WLCSPs.

Implementation Method 1

an elastic element positioned between the semiconductor wafer-form package and the circuit board structure

Methodology Applied

Scientific EffectElasticity: Elasticity

Implementation Method 2

a thermal adhesive layer that is coupled to a lower surface of the insulating encapsulation and to an upper surface of the thermal dissipating element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11906573B2Testing module and testing method using the same

Publication Date: 2024.02.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A testing module for a semiconductor wafer-form package includes a circuit board structure, first connectors, a first connecting structure, second connectors, third connectors and a first bridge connector. The circuit board structure includes two edge regions and a main region located therebetween. The first connectors are located over the edge regions and connected to the circuit board structure. The first connecting structure is located over and distant from the circuit board structure. The second connectors and third connectors are located over and connected to the first connecting structure, where the third connectors are configured to transmit electric signals for testing the semiconductor wafer-form package being placed over the main region. The first bridge connector is electrically coupling the circuit board structure and the first connecting structure by connecting the second connectors and the first connectors.