Wafer Tester Gas Interface for Arcing and Thermal Control
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Solution Overview
Problem
Existing microelectronic circuit testing methods are inadequate for early-stage defect identification and require improved testing apparatuses that can handle both wafer-level and die-level testing while maintaining thermal control and gas pressure management.
Innovation Solution
A tester apparatus with components for holding substrates, featuring pressure reduction passages, electrical testers, and gas supply passages, along with a portable supporting structure for thermal chucks and vacuum systems, to facilitate efficient testing of microelectronic circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If wafer-level testing is performed with handler and contactor, then early-stage defect identification is enabled, but thermal control and gas pressure management become insufficient
Solution Approach 1:
The testing system is divided into modular components: a portable wafer pack containing the wafer, thermal chuck, and gas management system can be independently handled and tested, while the main tester apparatus provides electrical testing capabilities. This segmentation allows wafer-level testing to be performed with improved thermal and gas pressure control.
Solution Approach 2:
A portable wafer pack serves as an intermediary device between the handler/contactor system and the electrical tester. The wafer pack includes a thermal chuck for thermal control and gas management systems, enabling early-stage testing while maintaining proper thermal and pressure conditions that were previously insufficient in direct handler-contactor testing.
2Measurement precision
If die-level testing is performed after singulation, then individual die defects are identified, but testing complexity and handling requirements increase
Solution Approach 1:
The portable wafer pack is designed to be universally compatible with both wafer-level and die-level testing. The same pack structure, thermal chuck, and gas management system can accommodate testing at different stages (on-wafer or after singulation), reducing the need for multiple specialized testing systems and simplifying handling procedures.
3Reliability
If enclosed cavity with pressure reduction is implemented, then gas management and thermal control are improved, but device structure becomes more complex
Solution Approach 1:
The pressure reduction passage and gas management components are nested within the portable wafer pack structure. The cavity seal forms an enclosed space that contains the wafer, thermal chuck, and gas management system in a compact, integrated arrangement. This nesting approach allows complex thermal and pressure control functions to be achieved within a compact portable package without proportionally increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective testing of microelectronic circuits by ensuring proper contact, thermal control, and gas management, thereby improving defect identification and reliability in early-stage manufacturing.
Implementation Method 1
a pressure reduction passage formed through one of the components, the pressure reduction passage having an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity, a pressure reduction supply connected to the pressure reduction passage, opening of the pressure reduction supply allowing gas out of the enclosed cavity
Implementation Method 2
a gas supply passage formed through one of the components, the gas supply passage having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity, and a gas inlet supply connected to the gas supply passage, opening of the gas inlet supply allowing gas into the enclosed cavity and into a space between the contacts
Implementation Method 3
a cavity seal between the first and second components, the cavity seal forming an enclosed cavity together with surfaces of the first and second components
Data Source
AI summary
A tester apparatus is described of the kind having contact with terminals on a wafer for purposes of testing the wafer. A dielectric gas is used to reduce arcing between the contact. A stationary structure and a portable structure have complimentary gas interfaces that engage when the portable structure engages with the stationary structure. A gas box has a channeling block connected to a dielectric gas pressure regulator and a nitrogen gas pressure regulator and connected to a gas supply passage to selectably provide nitrogen or dielectric gas to the gas supply passage. A tray has a portion that is electrically conductive to make contact with a rear wafer terminal, vacuum passages, and each vacuum passage has an enlarged section to reduce.