Wafer Tester Storage Container for High- and Low-Temperature Handling
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Solution Overview
Problem
Conventional wafer cassettes made of thermolabile materials face issues with melting or sticking when handling wafers at high or low temperatures, leading to increased test time and reduced testing efficiency.
Innovation Solution
A wafer tester with a storage container made of low-temperature or high-temperature materials and a conveying device that transfers wafers and auxiliary devices between the chuck, storage container, and wafer cassette, allowing immediate replacement and temperature stabilization without waiting for temperature recovery.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafers at high temperatures are placed back into the wafer cassette, then the testing process can be continued, but the wafer cassette may melt and stick to the wafers
Solution Approach 1:
The storage container is divided into multiple temperature-zoned compartments: a high-temperature zone for hot wafers, a low-temperature zone for cold wafers, and a neutral zone for ambient-temperature wafers. This segmentation allows wafers at different temperatures to be stored separately, preventing thermal shock and material degradation while enabling continuous testing operations.
Solution Approach 2:
A temperature-controlled transfer mechanism acts as an intermediary between the testing chamber and storage container. This intermediary system gradually adjusts temperature differences and facilitates safe transfer of wafers between zones, preventing direct thermal shock to the storage container materials.
2Loss of time
If wafers are placed back into the wafer cassette immediately after testing, then testing time is reduced, but the wafer cassette may melt or stick due to temperature differences
Solution Approach 1:
The storage container is pre-configured with multiple temperature zones before testing begins. High-temperature wafers are automatically directed to the high-temperature zone, low-temperature wafers to the low-temperature zone, and ambient wafers to the neutral zone. This preliminary arrangement eliminates the need for waiting periods and prevents thermal damage by ensuring wafers are stored in appropriate temperature environments from the start.
3Ease of manufacture
If a conventional plastic wafer cassette is used, then the device is simple and inexpensive, but it cannot withstand high or low temperatures
Solution Approach 1:
The storage container employs a composite structure combining temperature-resistant materials (such as metal or high-temperature plastics) for the main body with insulated compartments. This composite design provides both temperature resistance and manufacturing feasibility, allowing the container to withstand extreme temperatures while remaining practical to manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances testing efficiency by enabling immediate replacement and temperature stabilization of wafers and auxiliary devices, reducing overall test time and eliminating the need for waiting periods.
Implementation Method 1
the storage container is made of a highly thermally conductive material having a thermal conductivity greater than 1.4 W/m·K
Data Source
AI summary
A wafer tester and a storage container for the wafer tester are provided. The wafer tester includes a chuck, a probe card, a storage container, and a conveying device. The probe card is disposed above the chuck with respect to the chuck. The storage container includes a plurality of drawers, and the plurality of drawers are configured for carrying the test sample or an auxiliary device. The conveying device conveys the test sample or the auxiliary device among the chuck, the storage container, and the wafer cassette.