Wafer Thermal Control Plate with Segmented Fluid Circuits
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Solution Overview
Problem
Existing substrate cooling and heating systems in semiconductor manufacturing face challenges with slow heat mode changes and coolant vaporization during transitions, necessitating a more efficient and rapid thermal control solution.
Innovation Solution
A system comprising a plate with engraved fluid paths, connected to cool and hot tanks, heating and cooling devices, and switch valves controlled by a controller, allowing for rapid temperature adjustments by circulating heated or cooled fluid through the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a plate with high heat capacity is used for substrate thermal control, then temperature stability is improved, but heat mode change time increases
Solution Approach 1:
The thermal control system is segmented into separate heating and cooling circuits that can operate independently. The plate is divided into multiple heating zones with independent temperature control, allowing different regions to be heated or cooled simultaneously, thus reducing the overall heat mode change time while maintaining temperature stability.
Solution Approach 2:
The system employs dynamic control of fluid flow rates and temperatures through variable speed pumps and controllable valves. By dynamically adjusting the flow rate and temperature of the thermal control fluid based on real-time substrate temperature requirements, the system can rapidly switch between heating and cooling modes while maintaining precise temperature control.
2Temperature
If coolant is used for substrate cooling, then cooling efficiency is improved, but coolant vaporization occurs during heating mode transition
Solution Approach 1:
The system changes the physical parameters of the thermal control fluid by using different fluids for heating and cooling modes. A non-volatile fluid is used for heating to prevent vaporization, while a volatile coolant is used for cooling to maximize cooling efficiency. The system dynamically adjusts fluid properties and flow parameters to optimize performance for each mode.
Solution Approach 2:
The harmful vaporization effect is extracted and eliminated by separating the heating and cooling fluid systems. The cooling fluid circuit and heating fluid circuit are completely independent, with the cooling fluid being removed from the heating process. This prevents coolant vaporization during heating mode transition while maintaining high cooling efficiency when cooling is required.
3Device complexity
If a simple thermal control system is used, then device complexity is reduced, but temperature control precision decreases
Solution Approach 1:
The thermal control system uses a universal plate structure that serves both heating and cooling functions. The same plate, fluid circulation system, and control architecture are used for both heating and cooling modes, reducing overall system complexity. Despite this simplicity, precise temperature control is achieved through independent control of heating zones and dynamic fluid flow management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid and efficient heating or cooling of substrates by controlling fluid circulation, minimizing coolant vaporization and reducing transition times, with a thin, highly conductive plate design for enhanced thermal management.
Implementation Method 1
a cooling device configured to cool the fluid in the cool tank to a temperature below a first threshold
Implementation Method 2
a heating device configured to heat the fluid in the hot tank to another temperature above a second threshold
Implementation Method 3
a pump disposed on the input path and configured to pump the fluid in the input path into the plate
Implementation Method 4
a plate configured to control a temperature of the wafer placed on it
Data Source
AI summary
An apparatus with a wafer temperature control capabilities is presented. The apparatus comprising: a plate configured to control a temperature of the wafer placed on it, a cool tank and a hot tank to store a cool and hot fluid respectively, a cooling & heating device to cool & heat the fluid in the cool tank and the hot tank respectively, an exit switch valve configured to control a direction of the fluid coming out of the plate, an input switch valve configured to control a direction of the fluid going into the plate, a first fluid line, a second fluid line, a third fluid line, and a fourth fluid line; a pump configured to pump the fluid in the input path into the plate; and a controller configured to control an opening state of the exit switch valve and the input switch valve.