Semiconductor Wafer Thinning for Efficient Chip Separation
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Solution Overview
Problem
Current semiconductor manufacturing methods face inefficiencies in separating chip regions from semiconductor wafers due to the need to remove ring-shaped convex portions, which reduces the effective area of the device region and degrades manufacturing efficiency.
Innovation Solution
A manufacturing method where one surface of the semiconductor wafer is ground to create a thinner first part surrounded by a thicker second part, with a bonding surface of a tape attached to the opposite surface, allowing for precise separation using a rotary blade while minimizing warpage and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the ring-shaped convex portion is removed before separating chip regions, then the chip regions can be separated, but the effective area of the device region is reduced
Solution Approach 1:
The invention applies preliminary action by performing selective thinning of the first part (device region) before the separation process. This prepares the structure in advance so that during separation, the thinner first part can be cleanly detached from the second part without requiring removal of a ring-shaped convex portion, thereby preserving the effective area while enabling easy separation.
2Manufacturing precision
If the semiconductor wafer is processed with high accuracy to suppress warpage and deformation, then manufacturing precision is improved, but the separation process becomes more difficult
Solution Approach 1:
The invention applies local quality by creating a thickness difference between different parts of the semiconductor wafer. The first part (device region) is selectively thinned to a smaller thickness than the second part (peripheral region). This local variation in thickness allows the thinned first part to be easily separated while the thicker second part maintains structural integrity and suppresses warpage and deformation during processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves manufacturing efficiency by maximizing the effective area of the device region and reducing warpage and deformation during the separation process.
Implementation Method 1
cutting apart of the first part with a rotary blade in contact with the one surface side of the first part
Implementation Method 2
a bonding surface of a first tape is attached to a surface opposite to the one surface of the semiconductor wafer
Implementation Method 3
one surface of a semiconductor wafer is ground such that a first part is to be thinner than a second part surrounding the first part
Data Source
AI summary
Provided is a method of manufacturing a semiconductor device with improved manufacturing efficiency for the semiconductor device. The method of manufacturing a semiconductor device includes the steps of: (a) forming a circuit at a front surface side of a wafer (semiconductor wafer) having the front surface and a back surface opposite to the front surface; (b) grinding the back surface of the wafer that has a center part (first part) and a peripheral edge part (second part) surrounding a periphery of the center part in such a manner that the center part is thinner than the peripheral edge part; (c) attaching an upper surface (bonding surface) of a holding tape to the front surface of the wafer; and (d) separating the center part from the peripheral edge part by cutting a part of the center part with a blade (rotary blade) while the wafer is held by the first tape.