Wafer Tilt Detection Using 3-Axis Acceleration Feedback
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Solution Overview
Problem
Manual inspection of wafer tilt during transfer processes is time-consuming and prone to errors, leading to potential wafer damage or contamination.
Innovation Solution
A detection system using a three-axis acceleration sensor and controller to calculate tilt angles and trigger alarms when angle or acceleration thresholds are exceeded, ensuring safe wafer placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual inspection is used to check wafer tilt and fragments, then inspection personnel can visually assess wafer status, but the process becomes time-consuming and prone to missed or incorrect inspections
Solution Approach 1:
The patent replaces the manual visual inspection system with an automated detection system using a three-axis acceleration sensor mounted on the wafer. The sensor mechanically detects tilt angles during transfer, and a controller automatically processes the data to determine abnormal placement, eliminating the need for manual visual inspection and resolving the contradiction between inspection accuracy and time consumption
Solution Approach 2:
The wafer itself performs the inspection function through the mounted acceleration sensor, which autonomously monitors its own tilt status during transfer. The system enables self-detection without requiring external manual inspection, thereby improving reliability while reducing inspection time
2Productivity
If robotic arms transfer wafers quickly, then productivity increases, but excessive tilt during transfer may cause wafer scratches or breakage
Solution Approach 1:
The acceleration sensor provides real-time feedback on wafer tilt during transfer. The controller receives this feedback and can trigger alarm signals when abnormal tilt is detected, enabling immediate corrective action. This feedback mechanism allows high-speed transfer while preventing wafer damage through continuous monitoring
Solution Approach 2:
The system performs preliminary detection of tilt conditions during the transfer process itself, allowing preventive measures to be taken before actual damage occurs. The continuous monitoring enables early intervention when tilt exceeds safe thresholds, protecting wafers while maintaining transfer efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Automated detection of abnormal wafer placement status reduces inspection time and minimizes errors, enhancing safety and efficiency in wafer handling.
Implementation Method 1
a three-axis acceleration sensor disposed on the test object for detecting a three-axis acceleration of the test object
Data Source
AI summary
A detection system, a detection method and a detection device for object placement status are provided, and the detection system includes a test object, a three-axis acceleration sensor, and a controller. The three-axis acceleration sensor is disposed on the test object and detects a three-axis acceleration of the test object. The controller calculates a current tilt angle based on the three-axis acceleration of the test object. The controller calculates an angle difference between the current tilt angle and a reference tilt angle of the test object and determines whether the angle difference exceeds an angle threshold. When the controller determines that the angle difference exceeds the angle threshold, the controller triggers an alarm signal.