Wafer Top Plate Thermal Isolation for Precise Zone Temperature Control
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Solution Overview
Problem
Existing wafer temperature control devices face challenges in independently controlling temperature zones on a wafer surface due to heat conduction across smooth supporting surfaces, which hinders precise temperature control, especially near zone boundaries.
Innovation Solution
A wafer temperature control device featuring a temperature control sheet with multiple independently controllable temperature zones separated by division regions, paired with a top plate incorporating a heat insulating portion with lower thermal conductivity than the plate body, to prevent heat transfer between zones and allow precise temperature control for each zone.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a smooth surface is used to support the wafer, then the influence on the wafer back surface is reduced, but heat conduction between adjacent temperature zones occurs, preventing independent temperature control
Solution Approach 1:
The top plate is segmented into multiple independent temperature control zones by introducing heat insulating portions that divide the plate into distinct regions. Each region can be independently temperature-controlled without thermal interference from adjacent zones, enabling precise zonal temperature management while maintaining overall structural integrity.
Solution Approach 2:
The top plate incorporates regions with different thermal properties: heat conductive regions for efficient temperature control and heat insulating portions for thermal isolation between zones. This local differentiation of thermal conductivity allows each zone to maintain its desired temperature independently while the smooth surface regions continue to provide low influence on the wafer back surface.
2Manufacturing precision
If heat insulating portions are added to the top plate, then temperature control precision for each zone is improved, but device complexity increases
Solution Approach 1:
The heat insulating portions are integrated directly into the top plate structure, merging the thermal isolation function with the existing support plate. This consolidation eliminates the need for separate insulating components or complex multi-layer assemblies, achieving effective zonal temperature control through a unified, structurally simple design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective temperature control for each zone, reducing heat conduction between adjacent zones and allowing for desired temperature settings across the wafer surface, while maintaining a smooth surface for reduced influence on the wafer's backside.
Implementation Method 1
The top plate includes a heat insulating portion. The heat insulating portion is disposed at a position corresponding to the division region in the plate body, when viewed in a stacking direction of the temperature control sheet and the top plate. The heat insulating portion has a thermal conductivity lower than the thermal conductivity of the plate body.
Data Source
AI summary
A wafer temperature control device includes a temperature control sheet; and a top plate. The temperature control sheet includes a plurality of temperature control portions. The plurality of temperature control portions are divided from each other via a division region in the same plane. The plurality of temperature control portions are each independently controllable in temperature. The top plate includes a plate body stacked on the temperature control sheet. A surface of the plate body serves as a placement surface for a semiconductor wafer, the surface being opposite the temperature control sheet. The top plate includes a heat insulating portion. The heat insulating portion is disposed at a position corresponding to the division region in the plate body, when viewed in a stacking direction of the temperature control sheet and the top plate. The heat insulating portion has a thermal conductivity lower than a thermal conductivity of the plate body.