Wafer Transfer Alignment Detection Using Integrated Sensor Arrays
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Solution Overview
Problem
Existing semiconductor manufacturing processes face issues with wafer alignment due to software or hardware failures in aligners, leading to potential damage to facilities and process errors if wafers are not properly aligned.
Innovation Solution
An apparatus and method for detecting substrate state using a substrate transfer unit, sensor unit, and detection unit to identify the position of a notch, center, and alignment state of a substrate during transfer, preventing misalignment and potential damage by ensuring accurate alignment before processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a separate aligner is used to align wafers based on notch position, then wafer alignment accuracy is improved, but device complexity and potential points of failure increase
Solution Approach 1:
The patent extracts the alignment detection function from a separate aligner device and integrates it into the substrate transfer unit. The sensor unit detects the notch position and alignment state during the transfer process itself, eliminating the need for a dedicated aligner and reducing system complexity while maintaining alignment accuracy.
Solution Approach 2:
The substrate transfer unit is given multiple functions: it not only transfers substrates but also detects alignment state through the integrated sensor unit. This multi-functionality reduces the need for separate alignment equipment and simplifies the overall system architecture.
2Loss of time
If alignment detection is performed during substrate transfer, then detection timing is improved (earlier detection), but measurement precision may worsen due to motion
Solution Approach 1:
The alignment detection is performed preliminarily during the transfer process before the substrate enters the processing module. This early detection allows for timely correction or rejection of misaligned substrates, preventing waste of processing time and resources while the substrate is still in transit.
Solution Approach 2:
The sensor unit provides real-time feedback on substrate alignment state during transfer. The detection unit processes this feedback and determines alignment status, enabling dynamic adjustment or rejection decisions based on actual measured positions, thereby maintaining precision despite motion conditions.
3Measurement precision
If multiple sensor arrays are used to detect substrate state, then measurement comprehensiveness is improved, but device complexity increases
Solution Approach 1:
The sensor unit is divided into multiple sensor arrays positioned at different locations and orientations. Each sensor array detects specific aspects of substrate state (edge positions, notch orientation), and the detection unit integrates these segmented measurements to achieve comprehensive and accurate substrate state assessment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents damage to devices and process errors by detecting substrate misalignment during transfer, ensuring precise alignment and consistent processing.
Implementation Method 1
a sensor unit including one or more sensor arrays, and detecting a presence or an absence of the substrate in a position in which the one or more sensor arrays are disposed
Data Source
AI summary
The present disclosure provides an apparatus and method for detecting a substrate state, and provided is the apparatus for detecting a substrate state, including: a substrate transfer unit transferring a substrate; a sensor unit including one or more sensor arrays, and detecting a presence or an absence of the substrate in a position in which the one or more sensor arrays are disposed; and a detection unit detecting an alignment state of the substrate.