Wafer Transfer Arm Layout for Linear Vacuum Chamber Transport

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Solution Overview

Problem

Existing robotic transport systems for substrates in semiconductor processing face challenges in efficiently transporting substrates between multiple linearly arranged or side-by-side substrate holding locations without the need for handing off substrates between transfer robots or using linear slides, while also maintaining a sealed environment within the transfer chamber.

Innovation Solution

The use of one or more transfer robots with a stationary drive section that allows for the transport of substrates to at least two processing stations in a sequential linear arrangement, utilizing a static vacuum seal in vacuum environments and maintaining all rotary axes in a common base or drive section, thereby eliminating the need for linear bearings or motors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple transfer robots are used to transport substrates between substrate holding locations, then substrate transport capability is improved, but device complexity and the number of interfaces with the sealed environment increase

Engineering Contradiction:
Improvesubstrate transport capabilityVSAvoidnumber of transfer robots and interfaces
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Multiple transfer robots are merged into a single transfer robot that services multiple substrate holding locations. The transfer robot includes multiple end effectors that can simultaneously or sequentially handle substrates at different locations, reducing the overall number of robots and interfaces while maintaining substrate transport capability

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The transfer robot is designed with multi-functionality to service multiple substrate holding locations with a single unit. The robot can perform substrate pickup, transport, and placement operations at different locations using its multiple end effectors, making it a universal transport solution that replaces multiple specialized robots

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Ease of operation

If a linear slide is used to mount the transfer robot, then substrate transport along a linear path is enabled, but the number of interfaces with the sealed environment increases

Engineering Contradiction:
Improvelinear substrate transportVSAvoidnumber of interfaces with sealed environment
Core Design Contradiction:
Ease of operationVSDevice complexity

Solution Approach 1:

The linear slide mechanism is extracted from the sealed transfer chamber environment. The transfer robot is mounted to the interior wall of the transfer chamber, allowing it to move along a linear path without requiring a linear slide that would create additional interfaces with the sealed environment. This maintains ease of linear substrate transport while reducing interface complexity

Inventive Principle:
Principle #2Taking out (Extraction)

3Productivity

If substrates are handed off between multiple transfer robots, then substrate transport between locations is achieved, but processing time and system complexity increase

Engineering Contradiction:
Improvesubstrate transport between locationsVSAvoidsubstrate handoff time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

Multiple substrate handling functions are merged into a single transfer robot with multiple end effectors. This eliminates the need for substrates to be handed off between multiple robots, as one robot can simultaneously or sequentially handle substrates at multiple locations, reducing processing time and eliminating handoff delays

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient substrate transport between multiple processing stations without the need for substrate handoffs or linear slides, maintaining a sealed environment and reducing interfaces with the transfer chamber, thus enhancing the processing efficiency and cleanliness, especially for 450 mm semiconductor wafers.

Implementation Method 1

utilizing a static vacuum seal in vacuum environments

Methodology Applied
Scientific EffectVacuum seal: Vacuum

Data Source

PatentUS20250069939A1Substrate processing apparatus
Publication Date: 2025.02.27 BROOKS AUTOMATION US LLC
  • US20250069939A1 patent drawing
  • US20250069939A1 patent drawing
  • US20250069939A1 patent drawing

AI summary

A transfer apparatus, for transporting substrates, includes a drive section and a transfer arm fixed at one end with respect to a transfer chamber and including at least one arm link rotatably coupled to the drive section, forming an axis of rotation of the transfer arm at the fixed one end that is offset from a centerline of the transfer chamber bisecting the transfer between the two sides, and the transfer arm has an end effector. The drive section has motors with independent axes of rotation, where one degree of freedom of drive section motion rotates the arm link about the axis of rotation within the transfer chamber and the drive section drives the transfer arm to extend and retract the transfer arm so that the end effector of the transfer arm transports substrates.