Wafer Transfer Arm Retreated Positioning for Particle Control
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Solution Overview
Problem
In substrate processing systems, fine particles generated by the opening motion of gate valves can adhere to wafers, causing issues due to the miniaturization of semiconductor devices, and existing methods fail to effectively prevent these particles from reaching the substrates during transfer.
Innovation Solution
A substrate transfer method where the substrate is held at a retreated position deviated from the facing position of the partition valve during the opening motion, and moved in a circular motion to avoid fine particles produced by the gate valve opening, ensuring they do not adhere to the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the gate valve is opened to transfer the substrate, then the substrate transfer speed is improved, but fine particles are generated that adhere to the substrate
Solution Approach 1:
The substrate is moved to a retreated position before the gate valve opening operation commences. This preliminary positioning action ensures that when particles are generated by the valve opening, the substrate is already in a safe position where it will not be affected by the particles, thus preventing contamination while maintaining fast transfer speeds
Solution Approach 2:
The substrate is extracted from the facing position and relocated to the retreated position during the gate valve opening process. This separation removes the substrate from the harmful environment where particles are generated, allowing the transfer to proceed quickly without contamination risk
2Loss of time
If the substrate is held at the facing position for quick transfer, then transfer efficiency is improved, but particle contamination occurs
Solution Approach 1:
The substrate positioning to the retreated position is performed in advance before the gate valve opening. This preliminary action ensures that the substrate is already protected when particles are generated, maintaining both fast transfer timing and high substrate cleanliness without compromise
Solution Approach 2:
The retreated position acts as an intermediary safe zone between the substrate and the particle generation source (gate valve). By using this intermediate position during the valve opening operation, the system protects the substrate from contamination while maintaining efficient transfer timing
Data Source
AI summary
There is provided a substrate transfer method capable of preventing fine particles from adhering to a wafer. A substrate processing system 10 includes process modules 12 to 17 each having therein an inner space S1; a transfer module 11, having an inner space S2, connected to the process modules 12 to 17; and opening/closing gate valves 30 each partitioning the inner space S1 and the inner space S2. The transfer module 11 includes in the inner space S2 a transfer arm device 21 for holding a wafer W and for loading/unloading the wafer W into/from the process modules 12 to 17. The transfer arm device 21 holds the wafer W at a retreated position deviated from a facing position facing the gate valve 30 during an opening motion of the gate valve 30.