Wafer Transfer Isolation Assembly for Repeatable Ash Rates

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Solution Overview

Problem

In semiconductor processing, the transfer of wafers between chambers leads to energy transfer issues, causing photoresist shrinkage and unrepeatable ash rates due to temperature differences between wafers entering and leaving the chamber, resulting in low throughput and increased maintenance costs.

Innovation Solution

A transfer apparatus with an isolation assembly between transfer assemblies, such as an isolation sheet, is used to prevent energy transfer between wafers, ensuring consistent temperatures and repeatable processes by isolating infrared radiation and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If wafers are transferred between chambers using conventional transfer mechanisms, then workpiece transfer efficiency is maintained, but energy transfer between wafers causes photoresist shrinkage and unrepeatable ash rates

Engineering Contradiction:

Improverepeatability of ash ratesVSAvoidthroughput of workpieces

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

A thermal isolation assembly is introduced as an intermediary component between the first and second transfer assemblies. This assembly includes a thermal isolation member positioned between the wafers to prevent thermal energy transfer. The isolation member acts as a mediator that blocks heat radiation and conduction pathways, ensuring that the first wafer entering the chamber is not heated by the second wafer leaving the chamber, thereby maintaining photoresist integrity and achieving repeatable ash rates while preserving high throughput operation

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If thermal isolation measures are implemented between transfer assemblies, then photoresist shrinkage is prevented and process repeatability improves, but device complexity increases

Engineering Contradiction:

Improverepeatability of ash ratesVSAvoidcomplexity of transfer apparatus

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The thermal isolation member is implemented as a thin film or shell structure that provides effective thermal isolation without adding significant structural complexity. The isolation member can be a thin reflective barrier or insulating film that blocks thermal energy transfer while maintaining a compact transfer apparatus design. This approach achieves process repeatability without substantially increasing device complexity

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The thermal isolation assembly serves as a simple intermediary component that can be integrated into the existing transfer mechanism. By positioning the isolation member in the thermal pathway between wafers, the solution adds minimal structural elements while effectively preventing energy transfer, thus improving reliability without excessive complexity increase

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If wafers are transferred simultaneously in opposite directions, then throughput is increased, but energy transfer between wafers causes photoresist shrinkage

Engineering Contradiction:

Improvethroughput of workpiecesVSAvoidphotoresist shrinkage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The thermal isolation member is positioned between the first wafer entering the chamber and the second wafer leaving the chamber to block thermal energy transfer. This intermediary structure prevents the hot second wafer from heating the first wafer's photoresist during simultaneous bidirectional transfer operations, eliminating photoresist shrinkage while maintaining high throughput enabled by concurrent wafer transfer in opposite directions

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the repeatability of ash rates, reduces ash time, increases throughput, and decreases tool maintenance costs by maintaining consistent wafer temperatures during transfer.

Implementation Method 1

isolating infrared radiation and heat transfer

Methodology Applied

Scientific EffectInfrared radiation: Infrared Radiation

Implementation Method 2

isolation assembly...configured to isolate energy transfer

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS20240404858A1Transfer Apparatus And Processing System

Publication Date: 2024.12.05 BEIJING E TOWN SEMICON TECH CO LTD

AI summary

The present disclosure provides a transfer apparatus and a processing system. The transfer apparatus includes a first transfer assembly configured to transfer a first workpiece to a chamber. The transfer apparatus includes a second transfer assembly configured to transfer a second workpiece from the chamber. The transfer apparatus includes an isolation assembly disposed between the first transfer assembly and the second transfer assembly and configured to isolate energy transfer between the first workpiece and the second workpiece. The transfer apparatus further includes a support assembly configured to restrict the isolation assembly between the first transfer assembly and the second transfer assembly.