Integrated Wafer Transfer Mechanism with Rotation Chuck and OCR

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Solution Overview

Problem

Current robot assembly configurations in semiconductor fabrication facilities are limited in throughput and functionality, as multiple carrier arms are typically not independent, restricting maximum efficiency in object transfer and requiring separate robots for tasks like identification and alignment, which can lead to bottlenecks in processing.

Innovation Solution

An integrated transfer mechanism combining object transfer with object identification and alignment functionalities, utilizing simultaneous movements of robot bodies while decoupling end effector movements to enhance efficiency and reduce space constraints, incorporating OCR for identification and rotation chucks for alignment, and employing multiple independent or dependent robot assemblies coordinated by a controller.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple carrier arms are used for object transfer, then throughput is improved, but the arms are typically not independent which restricts maximum efficiency

Engineering Contradiction:
ImprovethroughputVSAvoidindependence of carrier arms
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The system divides the object transfer function into multiple independent robot assemblies (first robot assembly and second robot assembly), each capable of independently handling objects. This segmentation allows each assembly to operate autonomously while contributing to overall throughput, resolving the contradiction between increased productivity and operational independence.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Each robot assembly is designed with multi-functionality, capable of performing both object transfer and object alignment tasks. The first robot assembly can transfer objects while the second robot assembly performs alignment operations, and vice versa. This universal design enables independent operation of multiple assemblies, maximizing efficiency without requiring specialized single-function robots for each task.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If separate robots are used for identification and alignment tasks, then functionality is improved, but bottlenecks occur in processing

Engineering Contradiction:
ImprovefunctionalityVSAvoidprocessing efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The system merges identification, alignment, and transfer functions into an integrated robot assembly where these operations occur simultaneously during object movement. The first robot assembly transfers objects while performing alignment operations, and the second robot assembly performs identification during transfer. This merging eliminates sequential bottlenecks by executing multiple functions in parallel during the same time period.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The robot assemblies are designed to perform useful actions continuously during object transfer. While the first robot assembly moves objects between positions, the second robot assembly continuously performs alignment or identification operations on the same or different objects. This continuous parallel operation eliminates idle time and processing bottlenecks that would occur with sequential separate operations.

Inventive Principle:
Principle #20Continuity of useful action

3Productivity

If multiple independent robot arms are used, then throughput is doubled, but space requirements and system complexity increase

Engineering Contradiction:
ImprovethroughputVSAvoidsystem configuration
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

Each robot assembly is designed as a universal platform capable of performing multiple functions (object transfer, alignment, and identification). This multi-functionality reduces the need for additional specialized components and subsystems that would increase complexity. The same robot assembly structure handles different tasks by coordinating its movements and operations, thereby achieving high throughput without proportionally increasing system complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS7976263B2Integrated wafer transfer mechanism
Publication Date: 2011.07.12 BROOKS AUTOMATION US LLC
  • US7976263B2 patent drawing
  • US7976263B2 patent drawing
  • US7976263B2 patent drawing

AI summary

An integrated high speed robotic mechanism is disclosed for improving transport equipment, integrating an object movement with other functionalities such as alignment or identification. The disclosed integrated robot assembly typically comprises an end effector for moving the object in and out of a chamber, a rotation chuck incorporated on the robot body to provide centering and theta alignment capability, and an optional identification subsystem for identifying the object during transport. The present invention also discloses a transfer robot system, employing a plurality of integrated robot assemblies; a transfer system where a transfer robot system can service a plurality of connected chambers such as FOUP or FOSB; a front end module (FEM); or a sorter system. Through the use of these incorporated capabilities into the moving robot, single object transfer operations can exceed 500 parts per hour.