Retractable Wafer Transfer Bracket for Adjustable Cleaning Spacing
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Solution Overview
Problem
As the number of stacked memory chip layers increases, the thickness of wafers also increases, reducing the distance between neighboring wafers and impacting the cleaning effect during the cleaning process.
Innovation Solution
A wafer transfer device with a retractable bracket and drive mechanism that adjusts the distance between neighboring wafer support brackets, allowing for even spacing to accommodate wafers of different thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the number of stacked memory chip layers increases, then the wafer thickness increases, but the distance between neighboring wafers decreases which impacts cleaning effect
Solution Approach 1:
The bracket is designed to be movable rather than fixed, allowing it to dynamically adjust its position. The drive mechanism enables the bracket to extend and retract, changing the distance between neighboring wafer support brackets. This dynamic adjustment ensures that even when wafer thickness increases, the distance between wafers can be maintained at an optimal level for cleaning effectiveness.
Solution Approach 2:
The system changes the physical parameter of distance between wafer support brackets by controlling the extension and retraction of the movable bracket. This parameter change allows the cleaning apparatus to adapt to different wafer thicknesses while maintaining consistent cleaning performance, directly addressing the contradiction between increasing wafer thickness and maintaining cleaning effect.
2Quantity of substance
If wafer thickness increases to accommodate more stacked memory chip layers, then storage capacity increases, but the reduced distance between neighboring wafers deteriorates cleaning performance
Solution Approach 1:
The movable bracket with drive mechanism provides dynamic adjustment capability that allows the system to maintain optimal cleaning conditions regardless of the number of stacked layers. As wafer thickness increases with more layers, the bracket can be positioned to maintain appropriate spacing, ensuring cleaning performance is not compromised by increased storage capacity requirements.
3Manufacturing precision
If the distance between neighboring wafers is reduced due to increased wafer thickness, then the cleaning effect deteriorates, but increasing the distance would reduce storage efficiency
Solution Approach 1:
The movable bracket enables dynamic optimization of spacing between wafers. When cleaning is required, the bracket positions wafers at optimal distances for cleaning effectiveness. When storage efficiency is prioritized, the bracket can be positioned to maximize the number of wafers in the cleaning tank. This dynamic adjustment resolves the contradiction between cleaning effect and storage efficiency.
Solution Approach 2:
The system employs periodic adjustment of the bracket position to alternate between cleaning mode (optimal spacing for cleaning effect) and storage mode (maximized density). The drive mechanism enables this periodic repositioning, allowing the system to achieve both high cleaning effectiveness and high storage efficiency at different operational phases.
Data Source
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AI summary
The present disclosure provides a wafer cleaning apparatus and a wafer transfer device. The wafer transfer device includes a machine bracket, a drive mechanism, a retractable bracket, and a plurality of wafer support brackets. The drive mechanism and the retractable bracket are arranged at the machine bracket. An end of the retractable bracket is fixedly connected to the machine bracket. The second end of the retractable bracket is movably arranged at the machine bracket and arranged along the movement direction of the second end. The drive mechanism is connected to the retractable bracket and is configured to drive the second end to move to cause the retractable bracket to retract. The plurality of wafer support brackets are arranged at the retractable bracket. The distance between any two neighboring wafer support brackets changes as the retractable bracket extends and retracts. The distance between any two neighboring wafer support brackets is the same. With the above technical solution, the problem that the distance between the neighboring wafers cannot be changed when the wafer transfer device transfers the wafer can be solved.