Wafer Transfer Control for Substrate Processing

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Solution Overview

Problem

Conventional substrate processing apparatuses face productivity degradation due to the need for long maintenance times and disassembly/installation tasks, as production wafers are prevented from being loaded into process chambers during quality control checks, leading to inefficient operation modes.

Innovation Solution

Implementing a method that allows for separate operation modes within the substrate processing apparatus, including a maintenance mode, a quality control (QC) mode, and a production mode, where the transfer mechanism inhibits the transfer of production wafers during QC checks and quality control wafers during production, enabling efficient processing by designating specific process chambers for each task and ensuring QC checks are completed before processing production wafers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the process chamber is separated during QC check to prevent production wafers from being loaded, then the quality control is ensured, but the maintenance time becomes long and productivity is degraded

Engineering Contradiction:
Improvequality controlVSAvoidapparatus productivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent segments the wafer transfer control into different modes: maintenance mode where no wafers are transferred, QC mode where only QC wafers are transferred, and production mode where production wafers are transferred. This segmentation allows simultaneous QC checks and production operations in different chambers, resolving the contradiction between ensuring quality control and maintaining productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system dynamically switches between different operation modes (maintenance mode, QC mode, production mode) based on the current state of process chambers. The transfer mechanism adaptively controls wafer transfers according to the selected mode, enabling flexible operation that maintains both quality control and productivity.

Inventive Principle:
Principle #15Dynamics

2Ease of repair

If disassembling and installation work of the process chamber is required during maintenance, then the maintenance can be performed, but the maintenance time is long

Engineering Contradiction:
Improvemaintenance accessibilityVSAvoidmaintenance time
Core Design Contradiction:
Ease of repairVSLoss of time

Solution Approach 1:

The patent divides the maintenance operations into chamber-level segments where individual chambers can be maintained independently without affecting others. The transfer mechanism continues to operate in other chambers during maintenance, eliminating the need for complete system shutdown and reducing overall maintenance time.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system maintains continuous production operations in chambers that are not undergoing maintenance while maintenance is performed on specific chambers. The transfer mechanism operates continuously across the system, ensuring that useful actions (wafer processing) continue without interruption in unaffected chambers.

Inventive Principle:
Principle #20Continuity of useful action

Data Source

PatentUS8972036B2Method of controlling substrate processing apparatus, maintenance method of substrate processing apparatus and transfer method performed in substrate processing apparatus
Publication Date: 2015.03.03 KOKUSAI DENKI KK
  • US8972036B2 patent drawing
  • US8972036B2 patent drawing
  • US8972036B2 patent drawing

AI summary

Only a wafer for QC check may be transferred and a production wafer may prevent from being transferred into an assigned process chamber whose QC check is not completed after a maintenance task, and the production wafer may be processed the assigned process chamber after the completion of the QC check. The wafer for QC check is transferred while inhibiting a transfer of the production wafer into the assigned process chamber, and the production wafer is transferred into each of the process chambers of the plurality except the assigned process chamber.