Wafer Transfer Control for Uniform Processing
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in maintaining uniform processing states across substrates in the same lot due to individual differences and varying atmospheres in processing chambers, which is not acceptable for modern microfabrication requirements, leading to product variations and instability in the substrate-processing system.
Innovation Solution
A control device and method that select whether substrates are transferred in one-lot units or one-substrate units based on the degree of microfabrication requested, ensuring all substrates in a lot are processed in the same processing chamber to minimize variations, with the control device managing the transfer method independently of the host computer system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are sequentially transferred to different processing chambers to increase throughput, then productivity is improved, but manufacturing precision deteriorates due to variations in processing states across chambers
Solution Approach 1:
The system dynamically switches between two transfer methods (sequential transfer to different chambers vs. batch transfer to same chamber) based on real-time processing requirements and chamber availability, allowing flexible adaptation to maintain uniformity while optimizing throughput
Solution Approach 2:
The patent applies different transfer strategies to different substrate lots based on their specific processing requirements - high-precision lots receive batch transfer to same chamber while standard lots use sequential transfer to different chambers, optimizing both uniformity and throughput for each case
2Manufacturing precision
If transfer method is changed to maintain uniform processing state, then manufacturing precision is improved, but device complexity increases due to host computer system modifications
Solution Approach 1:
The transfer method selection logic is extracted from the host computer system and implemented independently in the substrate processing apparatus itself, eliminating the need for complex host computer modifications while achieving precise control over transfer methods
Solution Approach 2:
The substrate processing apparatus autonomously determines and executes the appropriate transfer method based on its own operational state and stored programs, without requiring external host computer control, thereby simplifying the overall system architecture
3Manufacturing precision
If host computer controls transfer method change for microfabrication, then manufacturing precision is improved, but ease of operation deteriorates due to complicated control requirements
Solution Approach 1:
The apparatus automatically selects and executes the appropriate transfer method based on pre-stored programs and its own operational parameters, eliminating the need for operators to manually control transfer method changes while ensuring high precision
4Manufacturing precision
If substrates are transferred to same processing chamber in one-lot units, then manufacturing precision is improved, but productivity decreases due to reduced parallel processing
Solution Approach 1:
The system dynamically adjusts transfer methodology based on lot characteristics and chamber availability - using batch transfer to same chamber when uniformity is critical, and sequential transfer to different chambers when throughput is prioritized, optimizing both parameters across different scenarios
Data Source
AI summary
Depending on the degree of microfabrication requested for each wafer lot, transfer of wafers is controlled. A substrate processing apparatus includes a plurality of PMs 400 and an LLM 500 and is controlled by an EC 200. The EC 200 includes a selection unit 255 and a transfer control unit 260. The unit 255 selects the PM to which the next wafer is to be transferred, and selects, for each lot, whether the wafers are transferred to the same PM in one-lot units or in one-substrate units depending on the degree of the microfabrication requested for each lot. When the wafer transfer in lot units is selected, the unit 260 sequentially transfers the wafers included in the lot to the selected PM. Otherwise the unit 260 sequentially OR transfers the wafers included in the lot from the selected PM to a different PM one by one.