Wafer Transfer Alignment Using Door Position Feedback

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Solution Overview

Problem

In semiconductor wafer production, position shift errors during transfer between transfer and process chambers lead to wafer damage and high defect rates due to inconsistent calibration and mechanical arm aging, as well as environmental changes affecting wafer positioning.

Innovation Solution

An apparatus with a first detection unit, comprising a transmit and receive end, to detect position information between the transfer unit and chamber door, and a control unit to adjust the transfer unit and chamber door operations, ensuring precise alignment and preventing wafer contact with the chamber door.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Extent of automation

If mechanical arm is used for wafer transfer, then transfer automation is improved, but position shift error increases due to calibration inconsistency and mechanical aging

Engineering Contradiction:
Improvewafer transfer automationVSAvoidwafer transfer position precision
Core Design Contradiction:
Extent of automationVSManufacturing precision

Solution Approach 1:

The patent employs detection units (optical sensors, encoders, or vision systems) to continuously monitor the position of the mechanical arm and wafer during transfer. This real-time feedback is sent to the control unit, which adjusts the mechanical arm's movement to compensate for position deviations, thereby maintaining transfer precision despite automation and mechanical aging

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent replaces purely mechanical positioning with a hybrid system that incorporates optical detection and electronic control. Detection units substitute for mechanical calibration, and the control unit substitutes for manual adjustment, eliminating the need for frequent mechanical calibration while maintaining precision

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If chamber door is provided for wafer transfer, then process chamber isolation is improved, but wafer damage risk increases due to position shift and wafer-door contact

Engineering Contradiction:
Improveprocess chamber isolationVSAvoidwafer damage from contact
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The detection unit monitors the relative position between the wafer and chamber door in real-time. When the wafer approaches the chamber door or position deviation exceeds a threshold, the control unit receives feedback and adjusts the mechanical arm's trajectory to prevent contact, thereby eliminating the harmful effect of wafer-door collision

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The system performs preliminary position verification before wafer transfer. The detection unit checks the chamber door position and wafer position in advance, and the control unit pre-adjusts the transfer path to avoid potential contact, preventing damage before it can occur

Inventive Principle:
Principle #9Preliminary anti-action

3Manufacturing precision

If position detection is implemented, then transfer precision is improved, but device complexity increases due to additional detection units and control systems

Engineering Contradiction:
Improvewafer transfer precisionVSAvoiddetection and control system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The detection units are designed to serve multiple functions: position detection, alignment verification, and collision prevention. The control unit integrates multiple control tasks (mechanical arm control, chamber door coordination, emergency stop) into a single system, reducing overall device complexity while maintaining high precision

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances wafer transfer precision, reduces damage rates, and improves production efficiency by accurately positioning the wafer and controlling chamber door operations based on real-time position data.

Implementation Method 1

a first detection unit, configured to detect position information between the transfer unit and the chamber door, and the first detection unit including a first transmit end and a first receive end

Methodology Applied
Scientific EffectElectromagnetic radiation transmission and reception: Electromagnetic Induction

Data Source

PatentUS12176233B2Apparatus and method for transferring wafer, and apparatus for controlling transferring wafer
Publication Date: 2024.12.24 CHANGXIN MEMORY TECH INC
  • US12176233B2 patent drawing
  • US12176233B2 patent drawing
  • US12176233B2 patent drawing

AI summary

The present disclosure provides an apparatus and a method for transferring a wafer, and an apparatus for controlling transferring a wafer. The apparatus for transferring a wafer includes a transfer chamber, at least one process chamber, a first detection unit, and a control unit, wherein the transfer chamber is provided therein with a transfer unit; the at least one process chamber is in connect with the transfer chamber, and a chamber door is provided at a connect position; the first detection unit includes a first transmit end and a first receive end, the first transmit end is provided on one of the transfer unit and the chamber door, and the first transmit end is provided on the other one of the transfer unit and the chamber door.