Wafer Transfer Support With Resistive Ground Path for ESD Control
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Solution Overview
Problem
In semiconductor manufacturing, static electricity accumulation on wafers during processing can lead to electrostatic discharge (ESD), causing defects in films and electronic elements due to inadequate ESD resistance in modern device designs.
Innovation Solution
A substrate transfer apparatus with a non-conductive support and a strip-shaped conductive path that connects a conductive contact to a grounding mechanism, ensuring appropriate impedance to prevent excessive current flow and potential damage from ESD.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive path is provided on the support to release electric charge to earth, then ESD protection is improved, but the risk of excessive current flow causing damage increases
Solution Approach 1:
The patent changes the electrical parameter (resistance) of the conductive path by inserting a high-resistance section with specific resistance value (10^6 to 10^12 Ω) between the low-resistance conductive contact and the grounding connector. This parameter modification allows the path to conduct static charge while limiting current to safe levels, resolving the contradiction between ESD protection and excessive current prevention.
Solution Approach 2:
The high-resistance conductive path section acts as an intermediary element between the conductive contact and the grounding connector. This intermediate component with controlled resistance mediates the charge discharge process, enabling static electricity release while preventing harmful current peaks that would occur with a direct low-resistance connection to earth.
2Object-affected harmful factors
If the support is made non-conductive to prevent short circuits, then electrical safety is improved, but the ability to release static charge deteriorates
Solution Approach 1:
The support structure employs local quality differentiation: the main support body remains non-conductive for safety, while a specific localized region contains a conductive path with controlled resistance. This localized conductive element provides the necessary charge release function without compromising the overall electrical safety of the non-conductive support structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses ESD by maintaining an appropriate resistance value in the conductive path, preventing damage to the wafer and ensuring reliable static electricity elimination.
Implementation Method 1
The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path... maintaining an appropriate resistance value in the conductive path
Data Source
AI summary
A substrate transfer apparatus includes: a non-conductive support with an upper surface that faces a substrate and supports the substrate; a mover that moves the support to transfer the substrate; a connector that connects the support and the mover while being grounded; a conductive contact that is provided on the upper surface of the support, and supports the substrate in contact with a lower surface of the substrate such that the substrate is not brought into contact with the support; a strip-shaped conductive path that is provided to connect the contact and the connector. The strip-shaped conductive path is provided with a bent portion such that an interval of the strip-shaped conductive path formed by the bent portion is at least twice a width of the strip-shaped conductive path.