Wafer Polishing Transfer Layout for Flexible Multi-Unit Handling
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Solution Overview
Problem
The existing chemical mechanical planarization equipment faces inefficiencies and flexibility issues due to the heavy load on the top transfer device, which limits wafer transfer efficiency and increases the risk of impurities and product defects, especially in staggered dual-platform and triple-platform processes.
Innovation Solution
A wafer polishing system with multiple transfer modes that utilize a wafer transfer channel with multiple working positions, a delivery structure, and a top transfer mechanism, allowing for flexible wafer transfer between polishing units and external stations without occupying additional space, and enabling the combination of conveyance and delivery structures with the top transfer mechanism for enhanced flexibility and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the top transfer device is used for wafer pickup, placement and transportation, then wafer transfer is enabled, but the transfer time increases substantially and transfer efficiency decreases
Solution Approach 1:
The transfer system is segmented into multiple independent transfer devices: a first transfer device for transferring wafers between adjacent polishing units, and a second transfer device for transferring wafers between the polishing unit and the external transfer station. This segmentation allows parallel transfer operations, reducing the workload and transfer time of any single device while improving overall wafer transfer efficiency.
2Productivity
If the top transfer device bears heavy transportation load, then wafer transfer capability is maintained, but the risk of impurities and device failure increases
Solution Approach 1:
The heavy transportation load is segmented and distributed across multiple transfer devices. The first transfer device handles transfers between polishing units, while the second transfer device handles transfers to and from the external transfer station. This load distribution reduces the burden on each individual device, lowering the risk of failure and impurity generation while maintaining overall transfer capability.
Solution Approach 2:
The first transfer device acts as an intermediary between polishing units, and the second transfer device serves as an intermediary between the polishing unit and external transfer station. These intermediary devices facilitate wafer transfer while isolating potential failure points, preventing single-point failures from affecting the entire system and reducing the risk of impurities.
3Area of stationary object
If the working part of the top transfer device is directly above the load ports, then compact layout is achieved, but frequent lowering for wafer pickup increases transfer time
Solution Approach 1:
The transfer functions are segmented between multiple devices positioned at different locations. The first transfer device is positioned to efficiently transfer wafers between adjacent polishing units, while the second transfer device handles external transfers. This segmentation allows each device to operate optimally without requiring frequent vertical movements, reducing transfer time while maintaining compact overall layout.
4Adaptability or versatility
If multiple transfer modes are implemented, then process flexibility is improved, but device complexity increases
Solution Approach 1:
The transfer system is divided into distinct functional segments: the first transfer device for inter-polishing unit transfers and the second transfer device for external transfers. Each segment is independently controlled and optimized for its specific function, providing process flexibility through multiple transfer modes while keeping individual device complexity manageable through clear functional separation.
Data Source
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AI summary
Disclosed in the present invention is a wafer polishing system, comprising polishing units. Each polishing unit comprises a wafer transfer channel and a polishing module; the polishing module comprises a polishing platform and a polishing arm, and the polishing arm can drive a wafer to move relative to the polishing platform; the wafer transfer channel is provided with at least two work stations, and a wafer loading/unloading table can move between the work stations; a transmission structure is provided between adjacent polishing units, a wafer is transferred between work stations of the adjacent polishing units along a first track, and the first track falls on wafer transfer channels; and/or a wafer loading/unloading table can move between adjacent polishing units; and/or a transfer structure is provided between a polishing unit and an external transition table, a wafer is transferred between work stations of the polishing unit and the external transition table along a second track, and the second track falls on a wafer transfer channel. Further disclosed in the present invention is a wafer transfer method. In the present invention, tracks all fall on wafer transfer channels, so that no other space is occupied, and the layout is reasonable; the process is flexible, and the processing efficiency is high; the transfer stability is high.