Wafer Transfer Mechanism With Linear Grooves For Multi-Wafer Handling
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Solution Overview
Problem
Conventional wafer handling and transfer mechanisms in semiconductor manufacturing are inefficient and prone to wafer contamination, particularly due to manual handling and the inability to handle multiple wafers simultaneously.
Innovation Solution
A wafer transfer apparatus with a susceptor having substrate holders with parallel linear grooves and a transfer mechanism with engaging fingers that can lift and transfer multiple wafers simultaneously, reducing contamination by lifting wafers via carrying rings without direct contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual handling of wafers is used, then operation simplicity is maintained, but wafer contamination increases and handling efficiency decreases
Solution Approach 1:
The patent introduces an automated transfer mechanism with engaging fingers as an intermediary between manual loading and wafer processing. These fingers automatically engage with the wafer's linear grooves and carrying rings to perform transfer operations, eliminating direct manual contact with the wafer surface while maintaining operational control through automation.
2Object-affected harmful factors
If conventional wafer transfer mechanism is used, then wafer contamination is partially reduced, but handling capacity is limited to one wafer at a time
Solution Approach 1:
The patent merges multiple wafer handling capabilities into a single transfer mechanism. The engaging fingers are designed to simultaneously engage with multiple wafers positioned on the susceptor, allowing the mechanism to transfer multiple wafers in one operation cycle. This combines the contamination protection of automated handling with the throughput of batch processing.
3Productivity
If automated transfer mechanism is implemented, then handling efficiency improves, but mechanism complexity increases
Solution Approach 1:
The transfer mechanism is segmented into discrete functional elements: multiple engaging fingers, each capable of independent wafer engagement through linear grooves and carrying rings. This segmentation allows the complex task of multi-wafer transfer to be divided into simpler, repeatable engagement and transfer cycles, making the overall system more manageable and maintainable.
Data Source
AI summary
Disclosed are a wafer transfer apparatus, a vapor deposition system, and a method of operating the vapor deposition system. The wafer transfer apparatus includes: a susceptor on which at least one holding element is provided, each holding element including at least two substrate holders, the each of the substrate holders being correspondingly provided with two linear grooves, the two linear grooves being oppositely disposed on a periphery of the each of the substrate holders, the substrate holders being configured to accommodate wafers, the linear grooves in a same holding element being parallel disposed; a transfer mechanism including a plurality of engaging fingers, the engaging fingers being configured to lift the wafers in the same holding element simultaneously via the linear grooves and handle the wafers to preset locations. The transfer mechanism disclosed may transfer at least two wafers at a time, whereby wafer handling and transfer efficiency can be effectively enhanced, while potential wafer contamination can be mitigated.