Rotating Wafer Transfer Module for Compact Notch Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer processing apparatus designs face challenges such as increased footprint and misalignment of notch direction when additional processing modules are attached, particularly in vacuum transfer systems.
Innovation Solution
A transfer apparatus is designed with a tubular connecting module and rotation mechanisms to connect vacuum transfer modules, allowing for simultaneous transfer of wafers and rings, and aligning the notch direction of wafers during transfer, thereby reducing footprint and improving throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If vacuum transfer modules are connected to increase the maximum number of processing modules, then processing capacity is improved, but footprint increases
Solution Approach 1:
The wafer support is rotatably attached within the tubular connecting module, allowing the transfer mechanism to be nested inside the connection structure. This eliminates the need for external transfer mechanisms, reducing the overall footprint while maintaining the ability to transfer wafers between multiple processing modules
Solution Approach 2:
The invention uses rotational movement within the tubular connecting module to achieve wafer transfer between modules. By utilizing rotational dimension rather than linear extension, the system can serve multiple processing modules arranged in different orientations without proportionally increasing footprint area
2Manufacturing precision
If a rotation module is provided to align substrate notch direction, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The tubular connecting module serves multiple functions: it connects processing modules, houses the transfer mechanism, and provides the rotation capability for alignment. This multi-functionality eliminates the need for separate rotation modules, reducing device complexity while maintaining alignment precision
Solution Approach 2:
The rotation mechanism is merged with the wafer support structure, which itself is integrated into the tubular connecting module. This consolidation of rotation and transfer functions into a single integrated system reduces the number of separate components and simplifies the overall device architecture
Data Source
AI summary
A transfer apparatus includes a first vacuum transfer module; a first transfer robot disposed in the first vacuum transfer module and at least one ring. In addition, a second vacuum transfer module is provided; and a second transfer robot is disposed in the second vacuum transfer module. A tubular connecting module is disposed between the first vacuum transfer module and the second vacuum transfer module. Further, the first vacuum transfer module, the second vacuum transfer module and the tubular connecting module are arranged along a first direction, with the tubular connecting module having a first length in the first direction, and the first length is smaller than the diameter of the wafer. A wafer support is rotatably attached to the tubular connecting module and at least three ring supporting members outwardly extend from the wafer support to support the at least one ring.