Wafer Transfer Module With In-Path Position Sensing
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Solution Overview
Problem
In substrate processing systems, positional deviations of wafers during transfer between processing spaces due to rotation arm vibrations or positional errors lead to reduced uniformity of wafer processing, as existing technologies lack effective detection and correction mechanisms.
Innovation Solution
A processing module with a rotation arm and sensors positioned between processing spaces to detect wafer positions during transfer, allowing for real-time correction of positional deviations by adjusting the stages to ensure wafers are centered, thereby maintaining processing uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wafers are transferred between processing spaces using a rotation arm, then processing efficiency is improved, but positional deviations occur due to rotation arm vibrations or positional errors
Solution Approach 1:
A sensor detects the actual position of the wafer during rotation arm transfer, and the control unit receives this detection result to calculate the deviation from the target position. This feedback mechanism enables real-time monitoring and correction of positional deviations caused by rotation arm vibrations or errors.
Solution Approach 2:
The control unit adjusts the stage position parameters based on the detected wafer position deviation. By dynamically changing the stage position parameter, the system compensates for positional errors and ensures the wafer is correctly positioned in the processing space despite rotation arm inaccuracies.
2Manufacturing precision
If stage position is adjusted to correct wafer positional deviation, then processing uniformity is improved, but additional time is required for position correction
Solution Approach 1:
The sensor detects wafer position during the transfer process, and the control unit calculates the required stage position adjustment in advance. By performing the position correction preparation beforehand, the system minimizes the actual time needed for correction and maintains processing efficiency.
Solution Approach 2:
The real-time detection of wafer position during transfer enables immediate calculation and adjustment of stage position. This feedback loop allows for rapid correction without significant time loss, as the system continuously monitors and adjusts positioning during the transfer operation itself.
3Measurement precision
If sensors are positioned between adjacent processing spaces to detect wafer positions, then detection accuracy is improved, but device complexity increases
Solution Approach 1:
Instead of using a single complex detection system, the patent divides the detection function into multiple sensors positioned at different locations between adjacent processing spaces. Each sensor detects wafer position from its specific viewpoint, and the control unit integrates this segmented detection data to achieve high overall detection accuracy.
Solution Approach 2:
The sensors positioned between processing spaces serve multiple functions: they detect wafer position during transfer, provide feedback for stage position adjustment, and enable real-time monitoring of wafer location. This multi-functional approach reduces the need for separate detection systems, thereby limiting the increase in device complexity.
Data Source
AI summary
A processing module includes: a processing container including therein processing spaces in which stages are disposed, respectively, wherein a center of each of the processing spaces is located on a same circumference; a rotation arm including holders configured to hold wafers, which are placed on the stages of the processing spaces, respectively, wherein the rotation arm is rotatable around a center of the circumference as a rotation axis; and a sensor located between adjacent processing spaces and configured to detect positions of the wafers held by the rotation arm during rotational operation of the rotation arm.