Wafer Transfer Tilt Detection Using 3-Axis Acceleration Sensing
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Solution Overview
Problem
Manual inspection of wafer tilt during transfer processes is time-consuming and prone to errors, leading to potential wafer damage or contamination.
Innovation Solution
A detection system using a three-axis acceleration sensor and controller to calculate tilt angles and trigger an alarm when angle differences exceed a threshold, ensuring safe wafer handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual inspection is used to check wafer tilt and fragments, then inspection personnel can visually assess wafer status, but the process becomes time-consuming and prone to missed or incorrect inspections
Solution Approach 1:
The patent replaces the manual visual inspection system with an automated sensor-based detection system. Acceleration sensors mounted on the wafer box continuously monitor tilt angles and detect wafer placement status, eliminating the need for manual visual inspection and providing reliable, error-free data collection
Solution Approach 2:
The system enables self-monitoring of wafer placement status through acceleration sensors that automatically detect and report abnormal tilt conditions. The robotic arm system benefits from self-provided feedback about wafer box orientation, allowing automatic adjustment without external inspection intervention
2Productivity
If robotic arms are used to transfer wafers, then automation efficiency is improved, but excessive tilt during transfer may cause wafer scratches or breakage
Solution Approach 1:
The patent implements a feedback mechanism where acceleration sensors continuously monitor the tilt angle of the wafer box during robotic transfer operations. When the tilt angle exceeds a predetermined threshold, the system generates feedback signals to adjust the robotic arm's movement, preventing excessive tilt that could cause wafer damage while maintaining transfer efficiency
Solution Approach 2:
The system takes preliminary anti-action by detecting abnormal tilt conditions before they cause wafer damage. The acceleration sensors monitor tilt angles in real-time and trigger corrective actions preemptively, preventing scratches or breakage before they occur during the transfer process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Automated detection of abnormal wafer placement status reduces inspection time and minimizes errors, enhancing safety and efficiency in wafer handling processes.
Implementation Method 1
a three-axis acceleration sensor disposed on the test object for detecting a three-axis acceleration of the test object
Data Source
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AI summary
A detection system, a detection method and a detection device for object placement status are provided, and the detection system includes a test object (1), a three-axis acceleration sensor (2), and a controller (5). The three-axis acceleration sensor (2) is disposed on the test object (1) and detects a three-axis acceleration of the test object (1). The controller (5) calculates a current tilt angle based on the three-axis acceleration of the test object (1). The controller (5) calculates an angle difference between the current tilt angle and a reference tilt angle of the test object (1) and determines whether the angle difference exceeds an angle threshold. When the controller (5) determines that the angle difference exceeds the angle threshold, the controller (5) triggers an alarm signal.