Wafer Translator for Thinned Semiconductor Testing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor manufacturing processes face challenges in economically and mechanically practicing wafer level testing of integrated circuits after thinning and dicing, as existing methods are not feasible or practical.
Innovation Solution
A wafer translator with a patterned layer of wafer bonding thermoset plastic is removably attached to the wafer, providing mechanical support during thinning and dicing, and enabling electrical pathways for wafer level testing before separating the wafer and translator.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wafer level testing is performed after thinning and dicing using conventional methods, then testing can be conducted, but the process is not economically or mechanically feasible
Solution Approach 1:
The wafer translator is prepared in advance with a patterned layer of wafer bonding thermoset plastic before the wafer is attached. This preliminary preparation enables subsequent thinning and dicing operations while maintaining mechanical support and electrical connectivity, making post-dicing testing feasible
Solution Approach 2:
The wafer translator acts as an intermediary device between the wafer and the testing equipment. It provides mechanical support during thinning and dicing while maintaining electrical pathways to the conductive regions, enabling testing after operations that would otherwise make testing impractical
2Productivity
If the wafer is thinned and diced before testing, then manufacturing steps are completed, but wafer level testing becomes impractical
Solution Approach 1:
The wafer translator serves multiple functions: it provides mechanical support during thinning, maintains electrical connectivity during dicing, and enables testing after both operations are complete. This multi-functionality allows testing to be performed after manufacturing steps without requiring separate handling or support structures
3Ease of manufacture
If additional handling steps are required for singulated die removal and packaging, then complete separation is achieved, but process complexity increases
Solution Approach 1:
The wafer bonding thermoset plastic layer is designed to be released after serving its purpose during thinning and dicing. The plastic layer can be discarded or recovered, allowing easy removal of singulated die from the wafer translator without requiring complex separation mechanisms or additional handling steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and practical wafer level testing of integrated circuits post-thinning and dicing, allowing for the removal and packaging of singulated die without the need for additional handling steps, thus improving the manufacturing process.
Implementation Method 1
A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair
Data Source
AI summary
A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator acts as a mechanical support during a thinning process as well as during a wafer dicing operation. The singulated integrated circuits are then removed from the wafer translator. In some embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer thinning process but before the wafer and wafer translator are separated. In other embodiments, wafer level testing of the integrated circuits on the wafer is performed subsequent to the wafer dicing operation but before the diced wafer and wafer translator are separated.