Wafer Transport Assembly With Integrated Buffers and Service Tunnel

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Solution Overview

Problem

In semiconductor fabrication facilities, space is limited and expensive, necessitating efficient space utilization while maintaining access for maintenance and service, which is challenging due to the close packing of process modules and limited access to equipment.

Innovation Solution

A compact cluster tool architecture with a service tunnel defined below the wafer transport modules, allowing for SEMI-compliant access space and incorporating buffer stacks within the same controlled environment as the wafer transport assembly to facilitate flexible wafer movement and storage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If process modules are closely packed to maximize space utilization, then space efficiency is improved, but access for maintenance and service deteriorates

Engineering Contradiction:
Improvespace utilizationVSAvoidaccess for maintenance
Core Design Contradiction:
Area of stationary objectVSEase of repair

Solution Approach 1:

The service tunnel is positioned beneath the wafer transport assembly, utilizing the vertical dimension to provide access space without increasing the horizontal footprint. This allows maintenance personnel to access critical components from below while keeping the overall equipment footprint compact for efficient fab floor space utilization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The system is divided into modular components including wafer transport modules, buffer modules, and process modules that can be independently accessed and maintained. The service tunnel provides segmented access paths to different modules, allowing maintenance personnel to reach specific components without disrupting the entire system.

Inventive Principle:
Principle #1Segmentation

2Adaptability or versatility

If buffer stacks are integrated within the controlled environment, then wafer storage flexibility is improved, but device complexity increases

Engineering Contradiction:
Improvewafer storage flexibilityVSAvoidsystem complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The buffer stacks are merged with the wafer transport assembly and positioned within the same controlled environment. This integration allows wafers to be stored and transported without exiting the controlled atmosphere, eliminating the need for additional airlock mechanisms and simplifying the overall system architecture while maintaining storage flexibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The buffer stacks serve multiple functions: storing wafers during processing, providing temporary holding capacity during equipment maintenance, and enabling flexible wafer routing between different process modules. This multi-functionality reduces the need for separate dedicated storage systems.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS11764086B2Wafer transport assembly with integrated buffers
Publication Date: 2023.09.19 LAM RES CORP
  • US11764086B2 patent drawing
  • US11764086B2 patent drawing
  • US11764086B2 patent drawing

AI summary

A substrate processing system configured to process substrates includes a substrate transport assembly that encloses a controlled environment defined within a continuous transport volume and at least two process modules coupled to the substrate transport assembly. The substrate transport assembly is configured to transport substrates to and from the at least two process modules through the continuous transport volume. At least two gas boxes are configured to deliver gas mixtures to the at least two process modules. An exhaust duct configured to selectively evacuate the at least two process modules through the at least two gas boxes. Surfaces of the at least two gas boxes include perforations configured to allow gases to flow from the at least two gas boxes into the exhaust duct.