Wafer Tray Sucker Module for Alignment Without Bending

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Solution Overview

Problem

Existing wafer handling devices face inefficiencies and potential damage due to repeated alignment and grasping of wafers by pneumatic jaws, causing deviation and bending, which affects production efficiency and risks damaging electronic elements.

Innovation Solution

A wafer handling device with a sucker module that includes a sucker body, airtight assembly, and pump, forming an airtight space with the wafer tray to stabilize and prevent bending, using airtight assemblies to support and maintain negative pressure for secure handling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pneumatic jaw holds wafer product from around for alignment and assembly, then wafer product can be positioned, but wafer product bends and depresses due to gravity causing deviation from alignment position

Engineering Contradiction:

Improvealignment precisionVSAvoidwafer product shape stability

Core Design Contradiction:

Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The sucker body is divided into multiple portions (first portion, second portion, third portion) with different accommodating heights, creating segmented support zones that distribute the wafer tray's weight and maintain its shape during handling

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses a pump to create negative pressure within the sucker body, forming an airtight space that securely holds the wafer tray without mechanical contact from above, preventing bending while maintaining positioning stability

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Manufacturing precision

If pneumatic jaw repeatedly holds and re-aligns wafer product, then correct positioning can be achieved, but production efficiency reduces and electronic elements may be damaged

Engineering Contradiction:

Improvepositioning accuracyVSAvoidproduction efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The airtight assembly and sucker body are designed to preliminarily support and stabilize the wafer tray in its correct orientation before the actual picking operation, ensuring that alignment is maintained during the entire handling process without repeated adjustments

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the traditional mechanical pneumatic jaw gripping system with a pneumatic suction system that holds the wafer tray from below through negative pressure, eliminating the repeated grasping and re-aligning operations that reduce efficiency and risk damage to electronic elements

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Ease of operation

If pneumatic jaw holds wafer product from around, then wafer product can be grasped and moved, but electronic elements on wafer product are at risk of damage

Engineering Contradiction:

Improvegrasping capabilityVSAvoiddamage risk to electronic elements

Core Design Contradiction:

Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The system uses pneumatic suction through the pump and suction tube to create negative pressure that securely grasps the wafer tray without mechanical contact from above, eliminating the risk of damaging electronic elements while maintaining easy handling and movement capability

Inventive Principle:

Principle #29Pneumatics and hydraulics

Solution Approach 2:

The airtight assembly creates a flexible seal between the sucker body portions and the wafer tray, allowing secure attachment and movement while avoiding rigid mechanical contact that could damage sensitive electronic components

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Stable and efficient wafer handling is achieved, preventing deviation and damage, enhancing production efficiency by ensuring precise alignment and uniform support during transport.

Implementation Method 1

forming an airtight space with the wafer tray to stabilize and prevent bending, using airtight assemblies to support and maintain negative pressure for secure handling

Methodology Applied

Scientific EffectNegative pressure: Vacuum

Data Source

PatentUS12575378B2Wafer handling device and sucker module thereof

Publication Date: 2026.03.10 WISTRON CORP

AI summary

A wafer handling device is configured to transport a wafer tray. The wafer handling device includes a sucker module and a transporting apparatus. The sucker module includes a sucker body, at least one airtight assembly, and a pump. The sucker body includes a first portion and a second portion. The first portion has a hole and a first air sucking hole. The second portion has a second air sucking hole. The airtight assembly is connected to the hole. The pump has a suction tube connected to the first air sucking hole and the second air sucking hole. The transporting apparatus is configured to move the sucker body. When the sucker body is connected to the wafer tray, the first portion, the second portion, and the wafer tray form an airtight space.