Wafer Tray Vacuum Suction and Thermal Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing circuit size on semiconductor wafers necessitates more extensive and efficient testing procedures, requiring faster attachment and detachment of wafers between different test heads and quicker initiation of testing to reduce overall testing time.
Innovation Solution
A wafer tray with vacuum suction passages for securing the semiconductor wafer and the test apparatus, along with a heater for temperature control, and an optional cooling medium circulation for thermal management, is integrated into a test apparatus. This setup includes a probe card with electrical contact points connected to the wafer, allowing for precise alignment and secure vacuum suction between the wafer tray and the test apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vacuum suction is used to fix the semiconductor wafer to the wafer tray and the wafer tray to the test apparatus, then the wafer can be securely held during testing, but the attachment and detachment process becomes time-consuming
Solution Approach 1:
The wafer tray is pre-equipped with vacuum suction passages and heating/cooling channels before the wafer is loaded. The vacuum suction system is pre-configured to immediately secure the wafer upon contact, eliminating the need for time-consuming alignment and attachment procedures during actual testing operations.
Solution Approach 2:
The patent utilizes vacuum suction through integrated flow passages to securely hold both the semiconductor wafer on the loading surface and the wafer tray itself on the test apparatus. This pneumatic mechanism provides reliable fixation without mechanical clamps or adhesives, enabling quick attachment and detachment while maintaining secure holding during testing.
2Adaptability or versatility
If multiple tests with different conditions are performed on a single semiconductor wafer, then testing coverage increases, but overall testing time increases
Solution Approach 1:
The wafer tray incorporates heating and cooling systems that can rapidly change temperature parameters between different tests. This allows the same wafer to undergo multiple tests under different thermal conditions without requiring physical removal or reconfiguration, thereby maintaining high testing throughput while increasing testing versatility.
Solution Approach 2:
The wafer tray is designed as a multi-functional platform that combines vacuum suction for secure holding, heating for thermal testing, and cooling for temperature control. This universal design enables a single tray to perform multiple different test conditions on the same wafer, increasing adaptability without sacrificing productivity.
3Stability of the object's composition
If the loading surface is heated to improve wafer handling and testing, then wafer stability improves, but energy consumption increases
Solution Approach 1:
The heating system operates periodically rather than continuously, activating only when wafer stability is required during specific testing phases. The cooling system similarly activates only when temperature reduction is needed. This periodic operation maintains wafer stability when necessary while minimizing energy consumption during non-critical periods.
Solution Approach 2:
The system dynamically adjusts temperature parameters based on testing requirements, switching between heating, cooling, and ambient temperature modes. This parameter control ensures wafer stability during critical testing operations while reducing energy consumption by avoiding continuous heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient and rapid testing of semiconductor wafers by ensuring secure vacuum suction and precise temperature control, thereby reducing testing time and improving throughput in semiconductor wafer testing.
Implementation Method 1
a heater for heating a loading surface on which at least the semiconductor wafer is loaded
Implementation Method 2
a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction; a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction
Implementation Method 3
a third flow passage that circulates a thermal medium or a cooling medium for cooling at least the loading surface
Data Source
AI summary
In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head.