Wafer Trimming for Thinned IC Edge Integrity
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Solution Overview
Problem
The existing integrated circuit packaging technologies face challenges in producing thinner ICs without edge chipping and cracking, which reduces manufacturing yield and increases costs due to the limitations of backgrinding processes.
Innovation Solution
The solution involves forming a trimmed edge on the integrated circuit wafer using a trimming process that eliminates sharp edges and stress during backgrinding, applying a thinning process, and using a fill material to prevent damage and improve surface quality, while also utilizing notch trimming to reduce stress on the wafer notch region.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If backgrinding process is applied to thin the semiconductor wafer, then IC thickness is reduced, but edge chipping and cracking occur reducing manufacturing yield
Solution Approach 1:
The wafer is pre-trimmed before backgrinding to remove sharp edges and reduce stress concentration. This preliminary action prevents edge chipping and cracking during the subsequent thinning process, allowing the wafer to be ground thinner without damaging the ICs at the periphery
Solution Approach 2:
The trimming process applies a counter-action to the stress that will be generated during backgrinding. By removing material from the edges beforehand and creating a relief groove, the process anticipates and prevents the harmful stress concentration that would otherwise cause cracking during thinning
2Length of moving object
If wafer is ground thinner to produce thinner ICs, then IC thickness is reduced, but manufacturing yield decreases due to edge damage
Solution Approach 1:
Edge trimming is performed as a preliminary step before backgrinding to prevent damage to ICs at the wafer periphery. This ensures that when the wafer is thinned, the ICs remain intact and can be successfully separated and packaged, thereby maintaining high manufacturing yield
Solution Approach 2:
The trimming process selectively removes material from specific regions (edges and relief grooves) where stress concentration occurs, while preserving the quality of the IC regions. This localized treatment prevents damage without affecting the overall thinning process or IC functionality
3Length of moving object
If backgrinding is applied to achieve thinner ICs, then IC thickness is reduced, but cracking occurs reducing reliability
Solution Approach 1:
The wafer undergoes preliminary trimming to remove sharp edges and create a relief groove before backgrinding. This pre-treatment reduces stress concentration points that would otherwise lead to cracking during the thinning process, ensuring wafer integrity is maintained throughout manufacturing
Solution Approach 2:
The trimming process applies a counter-action to the stress that will be generated during backgrinding by removing material from critical stress zones beforehand. This prevents the development of cracks that would compromise wafer integrity and IC reliability
Data Source
AI summary
An integrated circuit system includes an integrated circuit wafer, forming a trimmed edge on the integrated circuit wafer, and applying a thinning process on the integrated circuit wafer with the trimmed edge.