Wafer Transfer Turntable With Continuous Vacuum During Rotation
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Solution Overview
Problem
Existing wafer transfer processes in semiconductor manufacturing are unstable, leading to scratches and damages due to vibration, and rely on expensive six-axis robotic arms that reduce production efficiency by requiring wafers to wait in line for transfer.
Innovation Solution
A wafer transfer device with a base, fixed rings, rotating shaft, turntable, air suction pump, and driving mechanism that allows simultaneous transfer of multiple wafers between workstations using a turntable and carriers with suction passages, maintaining suction during rotation and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a six-axis robotic arm is used to transfer wafers between workstations, then the transfer can be performed, but the production efficiency is reduced and production time is prolonged due to sequential waiting
Solution Approach 1:
The system divides the wafer transfer function into multiple independent transfer mechanisms (first transfer mechanism and second transfer mechanism) that can operate simultaneously. Each mechanism handles specific wafer transfer tasks, allowing parallel processing and eliminating the sequential waiting inherent in single-robot systems.
Solution Approach 2:
The patent combines multiple transfer functions into a coordinated system where the first transfer mechanism transfers wafers from the first workstation to the second workstation, while the second transfer mechanism simultaneously transfers wafers from the second workstation to the third workstation. This merging of functions enables continuous flow and improves productivity.
2Productivity
If a single robotic arm serves multiple workstations, then cost is reduced, but wafers must wait in line for transfer which reduces production efficiency
Solution Approach 1:
The transfer system is segmented into multiple specialized transfer mechanisms rather than using one general-purpose robotic arm for all transfers. This segmentation allows each mechanism to be optimized for its specific function while operating in parallel, improving efficiency without requiring an excessive number of complex robotic arms.
Solution Approach 2:
The patent introduces intermediate transfer stations and coordinated control mechanisms that mediate between multiple workstations. These intermediaries enable smooth, simultaneous transfers between workstations without requiring direct complex coordination between all pairs of workstations, managing system complexity.
3Reliability
If the carrier vibrates, shakes, or sways during transfer, then the carrier can be simple in structure, but the stability of the transfer process cannot be maintained and wafers may be damaged
Solution Approach 1:
The carrier is designed with a counterweight that balances the mass distribution during rotation. This counterweight compensation reduces vibrations and shaking during the transfer process, maintaining stability without requiring overly complex damping mechanisms or rigid structures.
Solution Approach 2:
The system employs vibration damping mechanisms and precision control that anticipate and compensate for vibrations before they cause damage. The transfer mechanism is designed to minimize shock and vibration through controlled acceleration and deceleration profiles, protecting wafers from damage before harmful vibrations can occur.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Stabilizes wafer transfer, prevents scratches, and reduces production time and cost by enabling simultaneous transfer of multiple wafers without waiting, thus improving production efficiency.
Implementation Method 1
the air suction pump is connected to each channel and provided for extracting air from each air suction passage to form a negative pressure to suck each wafer
Implementation Method 2
the driving mechanism drives and rotates the turntable and rotating shaft using the central axis as an axis, and when the turntable and rotating shaft rotate, each port rotates with each corresponding fixed ring and keeps communicating with each ring groove
Data Source
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AI summary
A wafer transfer device includes a base (10), a plurality of fixed rings (20A-20D), a rotating shaft (30), a turntable (40), an air suction pump (50) and a driving mechanism (60). The fixed rings (20A-20D) are stacked sequentially and each has a channel (22) and a ring groove (211). The channel (22) is extended from an outer periphery of the fixed ring (20A-20D) and communicates to the ring groove (211). The rotating shaft (30) is connected to each fixed ring (20A-20D) and has a plurality of flow passages (33A-33D) corresponding to the fixed rings (20A-20D) and communicating to the ring groove (211). The turntable (40) is fixedly connected to the rotating shaft (30). The air suction pump (50) sucks each wafer (A), and the driving mechanism (60) drives and rotates the turntable (40) and the rotating shaft (30), so that each flow passage (33A-33D) rotates relative to each fixed ring (20A-20D) and keeps communicating with each ring groove (211) to maintain the suction of each wafer (A).