Wafer Turntable Marking for Multi-Wafer Grinding Traceability
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Solution Overview
Problem
The existing wafer grinding process lacks a system for recording the processing history of each wafer, including the time of grinding and the specific wafer turntable and positioning holes, which hinders efficient tracking and management of wafer processing.
Innovation Solution
A wafer grinding apparatus equipped with identification marks on turntables and tables, a robotic arm with suction cup modules and an image capture device, and a control unit to identify and record the placement and retrieval of multiple wafers, enabling simultaneous transfer and tracking of processing history.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer device transfers multiple wafers individually to their respective wafer turntables, then the overall efficiency of the process is improved, but the ability to track processing history of each wafer deteriorates due to lack of identification system
Solution Approach 1:
The patent uses image capture devices to create visual copies (images) of identification marks on wafers and mark-matching information on turntables. These visual copies are processed by image recognition algorithms to extract and record processing history data, enabling tracking without physical contact or additional hardware on the wafers themselves.
Solution Approach 2:
The system implements feedback by capturing images of identification marks, comparing them with stored mark-matching information, and using the recognition results to control the transfer device and record processing history. This closed-loop feedback mechanism ensures accurate tracking of each wafer's processing journey.
2Loss of information
If identification marks and image capture devices are added to track wafer processing history, then the tracking capability is improved, but the device complexity increases
Solution Approach 1:
The image capture devices are integrated into the existing transfer device structure, serving dual purposes: capturing identification marks for tracking and assisting in wafer positioning. The identification marks on turntables serve multiple functions including wafer position identification and turntable identification, reducing the need for separate tracking systems.
Solution Approach 2:
The system uses the existing identification marks on turntables and front/rear tables as self-identifying elements. The image capture devices automatically capture and process these marks without requiring external intervention, and the control unit autonomously matches marks and records processing history, minimizing the need for additional complex control mechanisms.
3Measurement precision
If multiple identification marks are placed on each wafer turntable for precise tracking, then the measurement precision is improved, but the device complexity increases due to additional marks and recognition requirements
Solution Approach 1:
The identification system is segmented into three distinct components: identification marks on wafers, mark-matching information on turntables, and image capture/recognition systems. This segmentation allows each component to be optimized independently and simplifies the overall system architecture by distributing the identification function across multiple elements rather than requiring a single complex system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the efficiency of wafer grinding by allowing simultaneous placement and retrieval of multiple wafers while accurately recording their processing history, thereby improving overall process management.
Implementation Method 1
Each of the suction cup modules comprises at least one vacuum suction cup for respectively sucking and releasing the wafer
Data Source
AI summary
Disclosed is a wafer grinding apparatus and a method for placing and retrieving multiple wafers. The wafer grinding apparatus has several wafer turntables, a driving device, a grinding device, a front table, a rear table, a transfer device, and a control unit. Each wafer turntable features several positioning holes for locating wafers and forms an identification mark for distinguishing and identifying each wafer turntable, a first positioning mark for identifying the placement center of the positioning holes, and a hole position mark for identifying each positioning hole. The wafer grinding apparatus is capable of transferring multiple wafers simultaneously and binding the corresponding identification mark and hole position mark of each wafer to form grinding records that facilitates tracking the processing history of each wafer.