Wafer Level Ultrasonic Chip Module Signal Interference
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Ultrasonic fingerprint recognition in smart electronic devices is hindered by signal interference and low accuracy due to ultrasonic signals being transmitted to areas not in contact with the finger, leading to incorrect fingerprint recognition.
Innovation Solution
A wafer level ultrasonic chip module is designed with a substrate, composite layer, conducting material, and base material, featuring a through slot and protective layer with an opening for the conducting material to enhance signal transmission directly to the finger, improving recognition accuracy by distinguishing and filtering interference signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If ultrasonic signal is transmitted through medium to areas not in contact with finger, then coverage area is increased, but fingerprint recognition accuracy deteriorates due to signal interference
Solution Approach 1:
The patent applies local quality by creating a through slot at a specific location to establish a direct ultrasonic transmission path from the ultrasonic body to the finger contact area. This localized structural modification ensures that ultrasonic energy is concentrated where needed (at the finger contact point) rather than dispersing through the entire medium, thereby improving recognition accuracy without sacrificing coverage area.
2Measurement precision
If conducting material is added to enhance signal transmission, then fingerprint recognition accuracy is improved, but device complexity increases
Solution Approach 1:
The conducting material serves as an intermediary element that facilitates ultrasonic signal transmission from the ultrasonic body through the protective layer to the finger. By introducing this intermediate conducting component, the patent enhances signal strength and recognition accuracy while maintaining a relatively simple overall structure, as the conducting material integrates seamlessly with the existing protective layer and substrate architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved ultrasonic chip module effectively transmits signals to the finger, enhancing fingerprint recognition accuracy by differentiating transmission speeds and filtering out interference, thus improving the overall recognition process.
Implementation Method 1
the ultrasonic module sends an ultrasonic signal to the finger and is capable of recognizing a fingerprint by receiving the intensity of the ultrasonic signal reflected back
Data Source
AI summary
A wafer level ultrasonic chip module includes a substrate, a composite layer, a conducting material, and a base material. The substrate has a through slot that passes through an upper surface of the substrate and a lower surface of the substrate. The composite layer includes an ultrasonic body and a protective layer. A lower surface of the ultrasonic body is exposed from the through slot. The protective layer covers the ultrasonic body and a partial upper surface of the substrate. The protective layer has an opening, from which a partial upper surface of the ultrasonic body is exposed. The conducting material is in contact with the upper surface of the ultrasonic body. The base material covers the through slot, such that a space is formed among the through slot, the lower surface of the ultrasonic body and an upper surface of the base material.