Wafer Testing System Using Vacuum Translator
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Solution Overview
Problem
Conventional semiconductor wafer testing systems are expensive and cannot be miniaturized, making it difficult to efficiently and effectively test individual dies on semiconductor wafers.
Innovation Solution
A wafer testing system that uses a wafer translator and interposer, which are releaseably attached via separately operable vacuums, to provide electrical connections to unsingulated integrated circuit pads without damaging them, allowing for efficient and cost-effective testing of semiconductor wafers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional probe card testing systems are used, then electrical testing of semiconductor wafers can be performed, but the system becomes expensive and cannot be miniaturized
Solution Approach 1:
The patent replaces the conventional mechanical probe card system with a vacuum-based attachment system. Instead of using expensive, complex mechanical probe cards that cannot be miniaturized, the invention uses a translator component with vacuum ports that create vacuum forces to hold the wafer. This substitution of mechanical probing with vacuum-based positioning enables system miniaturization while reducing costs.
Solution Approach 2:
The patent employs vacuum (pneumatic) forces to attach the translator to the wafer and to hold the wafer in position. Vacuum ports in the translator create vacuum forces that replace the need for expensive mechanical probe cards. This pneumatic approach enables cost-effective, miniaturizable testing systems while maintaining precise wafer positioning capability.
2Productivity
If vacuum forces are used to attach wafer to translator, then component wear is reduced and testing rate increases, but damage to sensitive pads may occur if pressure is not controlled
Solution Approach 1:
The patent makes the vacuum pressure dynamic and adjustable rather than fixed. The vacuum force can be adjusted based on the specific wafer and pad characteristics, allowing optimal balance between attachment strength and pad protection. This dynamic control enables high testing rates while preventing pad damage through adaptive pressure regulation.
Solution Approach 2:
The patent changes the vacuum pressure parameter to be adjustable and controllable. By varying the vacuum pressure level, the system can accommodate different wafer configurations and pad sensitivities. This parameter adjustment capability allows high-speed testing while maintaining safe pressure levels that prevent pad damage.
3Reliability
If separate vacuums are used for attaching translator to interposer and wafer to translator, then attachment control is improved, but system complexity increases
Solution Approach 1:
The patent segments the vacuum system into separate, independently controllable vacuum ports and pathways. One vacuum system attaches the translator to the interposer, while another vacuum system attaches the wafer to the translator. This segmentation provides independent control over each attachment interface, improving reliability while keeping each vacuum subsystem relatively simple and manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables quick and inexpensive testing of semiconductor wafers with reduced wear on components and increased testing rate, accommodating various wafer configurations with adjustable pressure forces, thus improving the efficiency and adaptability of the testing process.
Implementation Method 1
a first vacuum operable to create a pressure differential between a first surface of the wafer translator and a second surface of the interposer... a second vacuum operable to create a pressure differential between a first surface of the wafer and a second surface of the wafer translator
Data Source
AI summary
A wafer testing system and associated methods of use and manufacture are disclosed herein. In one embodiment, the wafer test system includes an interposer having a first surface and a second surface facing away from the first surface. The system also includes a wafer translator having a first side facing the second surface of the interposer and a second side facing away from the first side and toward a wafer, the first side carrying a plurality of first terminals at a first scale and the second side carrying a plurality of second terminals at a second scale. The first scale is greater than the second scale.