Wafer Warp Correction via Segmented Pressing and Cleaning
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Solution Overview
Problem
In semiconductor device manufacturing, wafer warping due to thermal expansion coefficient differences between materials leads to chuck errors, affecting alignment and exposure processes, and existing solutions that correct warping via peripheral pressing members or plates compromise wafer conveying speed and accuracy.
Innovation Solution
A processing apparatus with a conveying unit, a robot capable of selectively conveying a pressing member to correct wafer warp and a cleaning member to clean the chuck surface, controlled by a controller to execute pressing and cleaning processes simultaneously, allowing for high throughput and rapid recovery from chuck failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a periphery pressing member or pressing plate is provided on the wafer conveying robot to correct wafer warp, then wafer warping can be corrected, but the weight of the conveyed object increases making high-speed and accurate conveyance difficult
Solution Approach 1:
The pressing function is segmented from the wafer conveying robot and implemented as a separate pressing device. The pressing device includes a pressing member that can be positioned independently to apply pressure to the wafer surface, while the robot hand maintains its lightweight structure for high-speed conveyance. This separation allows warping correction without compromising conveyance speed.
Solution Approach 2:
A pressing device acts as an intermediary between the robot and the wafer. The pressing device includes a pressing member that applies force to the wafer surface to correct warping, while the robot hand only performs the conveying function. This intermediary structure enables warping correction without adding weight to the conveyed object.
2Manufacturing precision
If a periphery pressing member or pressing plate is provided on the wafer conveying robot to correct wafer warp, then wafer warping can be corrected, but subsequent wafers cannot be prepared causing long lot processing time
Solution Approach 1:
The pressing operation is segmented as a separate process step performed by a dedicated pressing device rather than being integrated into the robot's conveying cycle. This allows the robot to continue preparing subsequent wafers while the pressing device independently corrects warping on the current wafer, enabling parallel processing and reducing lot processing time.
Solution Approach 2:
The pressing device performs warping correction as a preliminary action before the wafer is conveyed to the exposure position. By correcting warping in advance using the pressing member, the system ensures proper wafer flatness for subsequent processing without delaying the overall workflow, as the pressing operation occurs during the robot's cycle time.
3Manufacturing precision
If the robot conveys the pressing member to correct wafer warp, then warping correction is achieved, but the robot cannot convey cleaning members for chuck surface cleaning
Solution Approach 1:
The pressing function is segmented from the robot and implemented as a separate pressing device with its own pressing member. This allows the robot to maintain its versatility by conveying different tools (cleaning members, other processing members) while the dedicated pressing device handles warping correction. The robot hand structure remains lightweight and adaptable for multiple functions.
Solution Approach 2:
The robot hand is designed for universal conveying of different members (cleaning members, pressing members, other processing tools) without being specialized for a single function. By separating the pressing function to a dedicated device, the robot can freely switch between conveying cleaning members for chuck surface cleaning and other processing members without structural modifications, enhancing overall system versatility.
Data Source
AI summary
A processing apparatus for processing a substrate chucked by a chuck installed on a stage includes: a conveying unit configured to convey the substrate to the chuck; a robot configured to selectively convey, to the stage, a pressing member capable of pressing the substrate to reduce a warp of the substrate chucked by the chuck and a cleaning member capable of cleaning a chuck surface; and a controller configured to cause the robot holding the pressing member to execute pressing processing for correcting the warp of the substrate and cause the robot holding the cleaning member to execute cleaning processing of the chuck surface.