Wafer Support Plate Warpage Sensing via Contact Current
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Solution Overview
Problem
Existing wafer treatment apparatuses face challenges in measuring warpage of wafers in real time due to complex configurations involving wires for signal reception from pressure sensors, which complicate design and interfere with other elements.
Innovation Solution
A wafer treatment apparatus with a support plate and temperature control channel, featuring warpage measurers with elastic supporters and conductive lower contacts that induce contact currents, allowing for real-time warpage measurement using ammeters to calculate contact positions based on current ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If pressure sensors with wires are used to measure wafer warpage, then warpage measurement capability is achieved, but device complexity increases and interference with other elements occurs
Solution Approach 1:
The patent extracts the signal transmission function from physical wires and implements it through the temperature control channel fluid. The fluid serves dual purposes: temperature control and warpage measurement signal carrier, eliminating the need for separate wire connections and reducing device complexity while maintaining measurement capability
Solution Approach 2:
The temperature control channel fluid is given multiple functions: it serves as both the temperature control medium and the signal transmission medium for warpage measurement. This multi-functionality reduces the number of separate systems needed, thereby reducing device complexity while preserving measurement capability
2Measurement precision
If pressure sensors with wires are used to measure wafer warpage, then warpage measurement capability is achieved, but ease of operation deteriorates due to design difficulties
Solution Approach 1:
The patent removes the complex wire routing and connection design from the system by using the temperature control channel fluid to carry measurement signals. This extraction of the signaling function simplifies the overall design process and improves ease of operation
Solution Approach 2:
The temperature control channel fluid acts as an intermediary that transmits warpage measurement signals from the wafer to the sensors without requiring direct wire connections. This intermediary approach simplifies design by eliminating complex electrical routing while maintaining measurement accuracy
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables real-time warpage measurement of wafers during treatment processes with a simple configuration, avoiding interference and complexity, and providing accurate warpage detection.
Implementation Method 1
an elastic supporter elastically supporting the upper and lower contacts in the recess
Implementation Method 2
When the warpage measurers are pressed by a weight of the wafer, the lower ends of the warpage measurers may come into contact with the fluid of the temperature control channel
Data Source
AI summary
Provided is a wafer treatment apparatus capable of measuring warpage of a wafer, the wafer treatment apparatus including a support plate providing a surface on which the wafer is supported, a temperature control channel mounted in the support plate to provide a path through which a fluid flows, and a plurality of warpage measurers disposed on the support plate and having lower ends mounted to be vertically spaced apart from an upper portion of the temperature control channel.