Wafer Weighing Device with Movable Support Platforms
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Solution Overview
Problem
Current weighing devices in the semiconductor fabrication field suffer from inferior precision when weighing wafers due to the trade-off between stability and cleanliness, particularly when handling differently sized wafers, as reducing contact area to prevent contamination affects the reproducibility and precision of weight measurements.
Innovation Solution
A weighing device with moveable support platforms that adjust to accommodate differently sized wafers, minimizing contact area to maintain cleanliness while ensuring stability through a driving mechanism and precise positioning, utilizing a combination of sensors and a controller to optimize the placement and height of support platforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the contact area between the weighing device and the wafer is reduced to prevent contamination, then the cleanliness of the wafer is improved, but the stability and precision of the wafer placement deteriorate
Solution Approach 1:
The support structure is divided into multiple support platforms instead of a single large contact area. Each support platform is positioned at specific locations (e.g., peripheral regions) to provide localized support, thereby reducing the total contact area with the wafer while maintaining stability through distributed support points.
Solution Approach 2:
The support platforms are strategically positioned at specific locations on the weighing device (such as peripheral regions) to provide support only where necessary for stability. This localized support approach minimizes the contact area with the wafer's critical regions while maintaining adequate stability for precise weighing.
2Measurement precision
If the contact area is increased to improve stability and precision, then the weighing precision is improved, but the cleanliness of the wafer deteriorates due to increased contamination risk
Solution Approach 1:
The support structure is divided into multiple support platforms instead of a single large contact area. Each support platform is positioned at specific locations (e.g., peripheral regions) to provide localized support, thereby reducing the total contact area with the wafer while maintaining stability through distributed support points.
Solution Approach 2:
The support platforms act as intermediary elements between the weighing device and the wafer. These platforms provide the necessary mechanical support and stability for precise weighing while minimizing direct contact with the wafer's sensitive areas, thus reducing contamination risk.
3Adaptability or versatility
If the weighing device is designed to handle differently sized wafers, then the adaptability is improved, but the device complexity increases
Solution Approach 1:
The support platforms are designed to be movable rather than fixed, allowing them to adjust their positions to accommodate differently sized wafers. This dynamic configuration enables a single device to handle multiple wafer sizes without requiring multiple fixed support structures for each size category.
Solution Approach 2:
The support platforms are designed to serve multiple functions: they provide stability for weighing, enable accommodation of different wafer sizes, and can be positioned at various locations on the weighing device. This multi-functionality reduces the need for separate specialized components for each wafer size.
Data Source
AI summary
Embodiments of the present application provide a weighing device that comprises a weighing unit for weighing wafers, a support structure placed on the weighing unit, at least two support platforms disposed on the support structure and each having a bearing surface for supporting peripheral regions of the wafers, and a driving part for driving the support platforms to move on the support structure, so as to adapt the at least two support platforms to bear the differently sized wafers. Since a wafer contacts merely several support platforms, cleanness of the wafer is better maintained during the weighing process; at the same time, the support platforms are enabled to stably bear differently sized wafers through adjustment of movements of the support platforms on the support structure.