Wafer Welding via Pulsed-Jet Microdrop Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for welding wafers using a moistening liquid result in defects such as structural deformation and microbiological deterioration due to general wetting, leading to an unappealing appearance and compromised adhesion properties.
Innovation Solution
Applying demineralized water or aqueous solutions in discrete microdrops to the wafer contact surfaces using a jet deposition method, which minimizes water contact and prevents penetration into the wafer structure, allowing for a heat-resistant weld without added cementing substances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a moistening liquid is applied by spraying onto the wafer surfaces, then adhesion between wafers is improved, but the wafer structure deforms and appearance deteriorates due to collapsed porous cells
Solution Approach 1:
The patent applies moistening liquid only to specific local areas of the wafer surface (adhesion zones) rather than general spraying. This is achieved through applicators that target only the regions where wafers contact each other, preserving the porous structure in non-contact areas while providing sufficient moisture for adhesion in contact zones.
Solution Approach 2:
The patent uses minimal amounts of moistening liquid applied only where necessary for adhesion, rather than excessive general wetting. This partial action approach applies moisture selectively to contact surfaces without over-saturating the entire wafer, preventing structural deformation while achieving adequate bonding.
2Ease of manufacture
If a moistening liquid is applied by spraying onto the wafer surfaces, then wafers can be joined by contact, but microbiological deterioration occurs due to increased water contact
Solution Approach 1:
The patent limits moistening liquid application to only the specific contact zones where wafers join, rather than general surface wetting. This localized approach minimizes the total water contact area, reducing the risk of microbiological deterioration while maintaining ease of manufacture through simple contact joining.
Solution Approach 2:
The patent converts the potential harm of water application into a benefit by using minimal, targeted moisture application. The small amount of water applied only to contact zones is sufficient for adhesion but too limited to promote microbiological growth, thus transforming the potential harm into a controlled beneficial effect.
3Strength
If general wetting of wafer surfaces is applied, then adhesion surfaces are activated, but a dense layer forms that alters appearance and reduces adhesion properties
Solution Approach 1:
The patent applies moistening liquid only to specific local contact zones rather than general surface wetting. This prevents the formation of dense layers in non-contact areas while activating adhesion surfaces locally where wafers join, maintaining both appearance quality and adhesion properties.
Solution Approach 2:
The patent uses minimal partial wetting of only the contact surfaces rather than excessive general wetting. This controlled partial action activates adhesion properties where needed without creating dense layers that would deteriorate appearance and adhesion quality in other regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves improved adhesion and appearance by reducing water exposure, preventing structural deformation and microbiological deterioration, while maintaining a hollow body without visible welding regions.
Implementation Method 1
Applying demineralized water or aqueous solutions in discrete microdrops to the wafer contact surfaces using a jet deposition method
Implementation Method 2
the aqueous moistening liquid is applied to at least one of the contact surfaces, and optionally to both of these surfaces, in the form of droplets (or preferably microdrops) which are discrete
Data Source
Figure 1~2
Figure 3~5
Figure 6
AI summary
Method for producing a hollow body formed by a pair of wafers (2, 2a), welded together along respective mating annular surfaces (4), by applying an aqueous moistening liquid to at least one of the mating surfaces of the wafers, previously subjected to baking, and by adhesion by mutual contact of said surfaces, characterized in that the moistening liquid is applied to said at least one surface in the form of separate and distinct droplets (G) by pulsed-jet deposition means, creating a relative motion between said jet deposition means and said wafers along the annular profile of said surfaces.