Waiting Station Gas Circulation for Semiconductor Substrate Processing
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Solution Overview
Problem
In heat treatment apparatuses for semiconductor wafers, the non-uniform gas flow in the waiting station leads to contamination from particles and organic substances, and the existing methods to address this, such as the atmosphere mode, face challenges in evenly distributing clean air and suppressing particle generation.
Innovation Solution
A substrate processing apparatus with a circulation path and exhaust path configuration that ensures uniform air flow in the waiting station, using a combination of nitrogen gas circulation and clean air supply to prevent contamination, including the use of buffer ducts and fans to maintain a high flow rate and prevent stagnation of clean air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If nitrogen gas is circulated from one side of the waiting station, then the apparatus structure is simple, but the gas flow becomes non-uniform causing contamination
Solution Approach 1:
The waiting station is divided into multiple regions with separate gas inlets and exhaust outlets positioned at different locations. This segmentation allows uniform distribution of nitrogen gas flow throughout the entire waiting station, preventing stagnant areas where particles and organic substances could accumulate, while maintaining a relatively simple overall apparatus structure.
Solution Approach 2:
Different regions of the waiting station are provided with localized gas inlets and exhaust outlets tailored to their specific requirements. This ensures that each local area receives appropriate gas flow to prevent contamination, while the overall system remains structurally simple and easy to implement.
2Object-affected harmful factors
If clean air is introduced from one side and exhausted from the other side in atmosphere mode, then particle prevention is improved, but the temperature of clean air increases during flow making even distribution difficult
Solution Approach 1:
The clean air supply system is segmented into multiple inlets distributed at different locations within the waiting station, and multiple exhaust outlets are positioned accordingly. This segmentation allows cool clean air to be supplied uniformly across different regions, preventing temperature increase and ensuring even distribution while effectively preventing particle contamination.
Solution Approach 2:
The gas flow system transitions from a one-dimensional flow (single inlet to single outlet) to a multi-dimensional distributed network of inlets and outlets throughout the waiting station. This dimensional change enables uniform temperature distribution and effective particle prevention by eliminating stagnant zones and ensuring comprehensive air circulation.
3Object-affected harmful factors
If gas inlets are disposed in the vicinity of the boat and wafer transfer equipment, then particle generation from these components is suppressed, but the wafer transfer speed decreases due to restricted movement range
Solution Approach 1:
Gas inlets are segmented and positioned at multiple locations including the vicinity of the boat and wafer transfer equipment, as well as other strategic positions throughout the waiting station. This segmented approach suppresses particle generation from moving components while maintaining sufficient open space for rapid wafer transfer operations, thus not restricting transfer speed.
Solution Approach 2:
Localized gas inlets are positioned specifically near particle-generating components like the boat and transfer equipment to provide targeted protection, while the overall waiting station maintains adequate space for high-speed wafer transfer. This local quality approach prevents particles without compromising productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform air flow and prevents contamination by ensuring a high flow rate of clean air, reducing the formation of natural oxidation films and particles, while also allowing for efficient nitrogen gas circulation, thus enhancing the heat treatment process and reducing costs.
Implementation Method 1
a circulation path configured to circulate gas throughout the waiting station
Implementation Method 2
an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station
Data Source
AI summary
A substrate processing apparatus includes a holder configured to hold a substrate and carry the substrate into a process chamber, a waiting station located outside the process chamber in which the holder waits prior to carrying the substrate into the process chamber, a circulation path configured to circulate a gas throughout the waiting station, and an exhaust path formed in the circulation path and configured to exhaust the gas from the waiting station.