Wall-Mounted Power Supply Thermal Management
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Solution Overview
Problem
Conventional power supply devices lack sufficient output ports and struggle with overheating due to high charging demands, especially in wall-mounted installations where space constraints limit the integration of advanced charging capabilities like USB Type-A and Type-C ports and high output currents.
Innovation Solution
A wall-mounted power supply receptacle design featuring a dual circuit board assembly with high thermal conductivity material, multiple output ports, and a modular top cover for easy disassembly, allowing for USB Type-A and Type-C ports within a compact, thermally managed structure that prevents overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple USB output ports are integrated into a wall-mounted power supply device, then the versatility and charging capability are improved, but the device complexity and space requirements increase
Solution Approach 1:
The patent combines multiple USB output ports (Type-A and Type-C) and traditional power outlets into a single integrated power supply device. The housing contains multiple circuit boards that are merged into one unit, providing both traditional power outlets and USB charging ports in a single wall-mounted device, thereby improving versatility without proportionally increasing complexity
Solution Approach 2:
The power supply device is designed to perform multiple functions simultaneously: it provides traditional power outlets for high-power appliances and USB Type-A/Type-C ports for electronic devices. The circuit board assemblies are configured to handle different power delivery protocols, making the device universally applicable to various charging needs
2Productivity
If high output current is provided for fast charging, then the charging speed is improved, but heat generation increases causing overheating
Solution Approach 1:
The patent converts the harmful heat generated by high-current fast charging into a beneficial thermal management system. Thermal pads are positioned between the circuit boards and the housing to conduct heat away from sensitive components. The housing structure itself acts as a heat sink, distributing and dissipating the thermal energy generated during fast charging operations
Solution Approach 2:
Thermal pads serve as intermediary elements between the high-power circuit boards and the housing structure. These thermal interface materials facilitate heat transfer from the circuit boards to the housing, which then dissipates the heat to the surrounding environment, preventing overheating while maintaining fast charging capability
3Area of stationary object
If the physical size is constrained by wall installation standards, then the installation compatibility is improved, but the space for electrical components is reduced
Solution Approach 1:
The patent employs a nested arrangement where multiple circuit boards are stacked vertically within the housing. The first circuit board assembly containing USB Type-A ports is positioned above the second circuit board assembly containing USB Type-C ports. This nested configuration allows multiple functional layers to coexist within the constrained wall-mounted footprint
Solution Approach 2:
The patent transitions from a horizontal layout to a vertical stacking arrangement of circuit boards. By utilizing the vertical dimension within the housing, the design accommodates multiple circuit board assemblies with different port types without increasing the horizontal footprint, thereby maintaining installation compatibility while expanding functional versatility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, reliable, and cost-effective power supply with multiple output ports, effectively managing heat and accommodating diverse charging needs, enhancing usability and installation ease.
Implementation Method 1
the first circuit board assembly is potted with a high thermal conductivity material
Data Source
AI summary
A wall mounted power supply receptacle device includes a body, a core disposed inside the body, and an insertion plate assembly. The body includes a upper body portion and a base connected to each other. The core includes a first circuit board assembly and a second circuit board assembly. The first circuit board assembly is accommodated inside the base and potted with a high thermal conductivity material. The insertion plate assembly includes insertion plates and wiring terminals and is mounted via a middle support frame above the first circuit board assembly. The second circuit board assembly is mounted via a grounding frame above the middle support frame. The grounding frame includes a U shaped notch that drops toward the base to accommodate the second circuit board assembly. The second circuit board assembly is electrically coupled to the first circuit board assembly through the wiring holes of the grounding frame.