Warp-Adaptive Substrate Holding for Precise Low-Load Positioning
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Solution Overview
Problem
Existing substrate holders apply excessive force on warped substrates due to downward pressing, which can cause damage and reduce throughput, especially when substrates vary in size, material, and thermal characteristics.
Innovation Solution
A substrate holder with a lifting and lowering mechanism, pressing members, and warp-detecting sensors that adjust the pressing operation based on detected substrate warp, minimizing contact pressure and maintaining throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If downward pressing is applied to hold warped substrates, then substrate positioning accuracy is improved, but substrate damage risk increases due to excessive load
Solution Approach 1:
Instead of pressing the substrate downward from above, the pressing member presses the substrate upward from below. This inversion of the pressing direction allows the substrate to be held securely while reducing the risk of damage from excessive downward force, as the substrate's own weight and the table support provide counterbalancing forces.
Solution Approach 2:
The pressing force is made adjustable based on the detected warp amount. The controller adjusts the pressing member's position and force according to the substrate's actual warp condition, ensuring sufficient holding force while minimizing excessive load that could damage the substrate.
2Productivity
If uniform pressing force is applied to all substrates, then processing simplicity is maintained, but throughput decreases due to damage risks with varied substrate characteristics
Solution Approach 1:
A warp detection sensor detects the actual warp amount of each substrate, and this information is fed back to the controller. The controller then adjusts the pressing member's position and force accordingly, enabling adaptive pressing that optimizes both substrate handling safety and processing throughput for varied substrate characteristics.
Solution Approach 2:
The pressing member's position and pressing force are made dynamic rather than fixed. The system adapts the pressing parameters in real-time based on the detected substrate warp, allowing the same system to handle substrates with different sizes, materials, and warp characteristics without manual reconfiguration.
3Manufacturing precision
If multiple plate-shaped holding members are arranged around substrate periphery, then substrate contact and positioning are improved, but device complexity increases
Solution Approach 1:
The holding mechanism is divided into multiple discrete pressing members arranged around the substrate periphery. Each pressing member can be independently controlled to press at specific locations, providing precise contact and positioning while allowing flexible adaptation to different substrate shapes and sizes without requiring a completely different mechanism.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurate warp detection allows controlled pressing, reducing substrate load and maintaining throughput by optimizing the pressing operation based on substrate shape, thus preventing damage and ensuring precise positioning.
Implementation Method 1
detecting a warp of the substrate mounted on the table from the peripheral side of the substrate based on the emission and absorption of light
Data Source
AI summary
An apparatus for holding a substrate includes a table, a lifting and lowering mechanism configured to mount a substrate on the table, and at least one pressing member configured to press the substrate to the table from the peripheral side of the substrate, in which the pressing member is movable upward and downward. The apparatus further includes at least one detector configured to detect a warp of the substrate mounted on the table from a peripheral side of the substrate, and a controller configured to control a movement of the pressing member in accordance to the detected warp.