Warpage Control in Redistributed Chip Packaging Panels
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Solution Overview
Problem
Warping during the encapsulation of electronic devices, particularly in redistributed chip packaging panels, poses handling and manufacturing challenges, affecting yield and cost, as existing embedded ground planes produce fixed warpage that cannot be manipulated.
Innovation Solution
The implementation of a combination of global and local warpage control elements, including an embedded ground plane and metal posts, which provide independent coarse and fine adjustments to control warpage, allowing for a flat panel surface necessary for successful build-up, solder print, and singulation processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If an embedded ground plane is used to provide structural support, then the panel gains stability and strength, but the panel exhibits fixed warpage that cannot be manipulated
Solution Approach 1:
The patent divides the warpage control function into two independent segments: a global warpage control element (embedded ground plane) that provides overall structural stability, and local warpage control elements (adjustable posts) that provide fine-tuned warpage adjustment. This segmentation allows each element to specialize in one aspect of warpage control without compromising the other.
Solution Approach 2:
The patent introduces dynamically adjustable local warpage control elements in the form of posts with variable heights. These posts can be adjusted to different positions to compensate for warpage variations, transforming the static warpage control system into a dynamic one that can adapt to different warpage conditions while maintaining overall panel stability.
2Manufacturing precision
If the panel is made flat for build-up and soldering processes, then manufacturing precision is improved, but handling during saw operation becomes difficult without external support
Solution Approach 1:
The patent applies preliminary action by pre-configuring the local warpage control posts to the appropriate heights before the build-up and soldering processes. This preliminary adjustment ensures the panel achieves the required flatness for these precision operations, and the posts remain in place to provide continued support during subsequent handling and saw operations.
Solution Approach 2:
The local warpage control posts serve as intermediary elements between the embedded ground plane and the panel surface. They mediate the warpage control function by providing adjustable support that maintains panel flatness for manufacturing processes while also serving as temporary structural support during handling and saw operations, eliminating the need for external carriers.
3Manufacturing precision
If local warpage control elements are added to adjust warpage, then warpage control precision is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by placing warpage control posts only at specific locations where local warpage adjustment is needed, rather than uniformly across the entire panel. Each post is positioned to address specific local warpage issues, providing precise control where required while minimizing the overall number of control elements and reducing system complexity.
Data Source
AI summary
A method is disclosed for controlling warpage in an integrated electronic panel assembly including a plurality of die embedded within an encapsulant. The method comprises determining a number of build-up layers required for the integrated panel assembly. Each build-up layer contributes an amount of concavity to the integrated electronic panel assembly. A level of global convex warpage on the integrated panel assembly is then predicted, wherein the global convex warpage is provided by the presence of an embedded ground plane (EGP) alone within the integrated panel assembly and in the absence of any build-up layers. The embedded ground plane includes openings therein for accepting at least one die within a corresponding opening and it contributes a fixed amount of global convex warpage. An amount of local convex warpage to be introduced into the integrated electronic panel assembly is then determined, which together with the fixed amount of global convex warpage provides a combined convex warpage to the integrated electronic panel assembly. Accordingly, the global and local convex warpage counteract the concavity to be introduced subsequently by a build-up layer processing and is sufficient to enable subsequent planar processing of a completed integrated electronic panel assembly.