Warpage Control Carrier for Semiconductor Packaging

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Solution Overview

Problem

Panel warpage in semiconductor device packaging poses challenges during encapsulation and redistribution, affecting yield, reliability, and costs due to difficulties in forming connections to semiconductor die.

Innovation Solution

A reusable warpage control carrier with plateau regions separated by channels is used, where the plateau regions are formed through additive or subtractive processes, and filled with structural material to minimize warpage, providing enhanced structural properties and maintaining a planar condition during packaging operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If panel-level packaging encapsulation is performed, then productivity is improved through batch processing, but warpage occurs affecting manufacturing precision

Engineering Contradiction:

Improvebatch processing efficiencyVSAvoidpanel planarity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The carrier is segmented into multiple plateau regions separated by channels, allowing each region to be processed independently while maintaining overall panel stability during batch encapsulation operations

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The carrier uses composite structure combining plateau regions with channels filled with structural material, creating a multi-material system that provides both mechanical support and warpage control during packaging processes

Inventive Principle:

Principle #40Composite materials

2Reliability

If encapsulation and redistribution processes are performed, then device functionality is achieved, but warpage develops affecting subsequent connection formation

Engineering Contradiction:

Improvedevice functionalityVSAvoidpanel flatness

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The carrier is prepared with plateau regions and channels filled with structural material before packaging operations begin, establishing warpage control measures in advance to prevent deformation during subsequent encapsulation and redistribution processes

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The carrier acts as an intermediary substrate that supports the semiconductor die during encapsulation and redistribution, providing a stable platform that isolates the delicate die from warpage-inducing stresses

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If structural material is added to fill channels, then warpage control is improved, but device complexity increases

Engineering Contradiction:

Improvewarpage controlVSAvoidcarrier structure

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The carrier incorporates channels that can be filled with structural material, creating a porous-like structure that provides warpage control while maintaining a relatively simple overall carrier geometry and fabrication process

Inventive Principle:

Principle #31Porous materials

Data Source

PatentUS11728285B2Semiconductor device packaging warpage control

Publication Date: 2023.08.15 NXP USA INC

AI summary

A method of manufacturing a carrier for semiconductor device packaging is provided. The method includes forming a carrier having a plurality of plateau regions separated by a plurality of channels. The carrier is configured and arranged to support a plurality of semiconductor die during a packaging operation. The plurality of channels is filled with a material configured to control warpage of the carrier.