Warpage Measurement Using Projected Optical Patterns
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Solution Overview
Problem
Warpage measurement in semiconductor device packages is challenging due to contamination from patterns applied for geometric information, which can affect electrical and thermal conductivity and lead to issues like open circuits.
Innovation Solution
An apparatus comprising a first image capture module, a second image capture module, and a projector, where the modules and projector have specific optical axes angles relative to the carrier surface, allowing for the projection and capture of patterns to determine warpage without leaving residue, using techniques like shadow moiré, laser reflection, or three-dimensional digital image correlation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a pattern is applied to the semiconductor device package for geometric information measurement, then measurement capability is improved, but contamination occurs that adversely affects electrical and thermal conductivity
Solution Approach 1:
The patent uses a projector to create a virtual pattern (optical copy) on the semiconductor device package instead of applying physical paint spots. This projected pattern serves as the measurement reference and can be removed simply by turning off the projector, eliminating contamination issues while maintaining measurement capability
Solution Approach 2:
The patent replaces the mechanical application of physical patterns (paint spots) with an optical projection system. The projector uses light to create measurement patterns on the package surface, substituting mechanical deposition with optical field interaction, thereby eliminating residue contamination
2Measurement precision
If a camera is used to capture images for geometric information, then warpage measurement is enabled, but the captured images may include unwanted pattern residue that affects measurement accuracy
Solution Approach 1:
The system performs preliminary action by projecting the measurement pattern onto the package before image capture. The projector creates the necessary optical reference pattern in advance, ensuring that the pattern is present during camera capture but can be completely removed afterward by simply stopping the projection, preventing any residue-related measurement errors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately measures warpage with improved precision and resolution, reducing contamination risks and enhancing the performance of semiconductor device packages by eliminating the need for physical paint spots.
Implementation Method 1
a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier
Implementation Method 2
The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier
Data Source
AI summary
An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.