Warpage Stabilization Structure for Conductor Boards
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Solution Overview
Problem
Conductor boards experience warpage due to differences in the coefficient of thermal expansion between materials, leading to deformation and potential functional failure, which existing technologies have not adequately addressed.
Innovation Solution
A device with a warpage stabilization structure, comprising through-crossing connections that are asymmetrically oriented and filled with electrically conducting material, such as copper, to counteract thermomechanical tensions and prevent warpage by generating internal mechanical pre-loads that impede warpage tendencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If different materials (glass, stiff materials) are embedded in FR4 conductor boards to achieve miniaturization and higher resolution, then connection precision and component density are improved, but internal tensions arise due to different coefficients of thermal expansion causing warpage
Solution Approach 1:
The patent applies preliminary anti-action by introducing a warpage stabilization structure that generates counteracting internal tensions before thermal expansion occurs. The stabilization structure is designed with asymmetric orientation and deformation capability to preemptively counteract the warpage forces that will arise from differential thermal expansion between embedded materials and the FR4 substrate during temperature changes.
Solution Approach 2:
The patent employs composite materials by combining the FR4 substrate with a warpage stabilization structure made of different materials having distinct thermal expansion properties. This composite construction allows the stabilization structure to compensate for warpage through its own deformation characteristics, creating a balanced system that maintains structural stability despite varying thermal expansion coefficients of the embedded components.
2Adaptability or versatility
If the conductor board is designed to accommodate multiple layer structures with embedded components, then functional integration is improved, but warpage occurs due to thermomechanical tensions from temperature changes
Solution Approach 1:
The patent applies segmentation by dividing the conductor board into distinct functional layers and embedding components at different levels. The warpage stabilization structure is integrated as a separate element within this multi-layer configuration, allowing each layer and component to maintain its specific function while the stabilization structure independently counteracts warpage forces across the entire assembly.
Solution Approach 2:
The patent addresses planarity issues by introducing a third-dimensional solution: a warpage stabilization structure with asymmetric orientation and spatial distribution. Rather than attempting to maintain perfect two-dimensional planarity, the structure utilizes three-dimensional deformation capacity and asymmetric geometry to counteract warpage forces, allowing the conductor board to accommodate multiple layers and embedded components while maintaining overall structural integrity.
3Stability of the object's composition
If through-crossing connections are added as warpage stabilization structures, then warpage suppression is improved, but device complexity increases
Solution Approach 1:
The patent applies multi-functionality by designing the warpage stabilization structure to serve dual purposes: it provides mechanical stabilization to counteract warpage forces while simultaneously functioning as through-crossing connections for electrical conductivity. This integration allows the same structural element to address both warpage suppression and electrical connectivity requirements, thereby reducing overall device complexity rather than increasing it.
Solution Approach 2:
The patent merges the warpage stabilization function with the electrical connection function by integrating the stabilization structure as through-crossing connections that are asymmetrically oriented and filled with electrically conductive material. This combination eliminates the need for separate stabilization elements and connection elements, reducing structural complexity while achieving both warpage suppression and electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses warpage in conductor boards by creating internal tensions that counteract thermally induced deformations, enhancing mechanical stability and preventing undesired warping, while also serving as electrically conductive connections between components.
Implementation Method 1
Different values of the coefficient of thermal expansion (CTE), ever higher resolution and increasing precisions. In result, a debonding of partly-elastic FR4 materials by glasses and other stiff materials is effected. All these trends lead to an undesired warpage (or deformation, or distortion).
Implementation Method 2
The warpage stabilization structure may be configured to counteract such internal tensions. However, the active principle (or method of action) of the warpage stabilization structure may also be formed such that the warpage stabilization structure evokes (or induces) a stiffening (or reinforcement) at and/or in the device, under the influence of which stiffening the formation of the warpage may not even be effected.
Data Source
AI summary
Disclosed is a device for electrically connecting components, which device has at least one electrically insulating layer structure, at least one electrically conducting layer structure, which is stacked and consolidated with the at least one electrically insulating layer structure under formation of a stack of layers, and a warpage stabilization structure for stabilizing the device in a warpage-suppressing manner, which structure at least partially pervades layer structures of the stack of layers.