Socket Fixture for Warped Memory Module Testing
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Solution Overview
Problem
Robotic arms struggle to insert warped memory modules into test sockets due to their lack of adaptability, often causing the module's warpage to get caught, hindering proper insertion and potentially damaging the module.
Innovation Solution
The design incorporates funnel guides and extender sockets with a pusher plate and perpendicular rods to guide and align warped memory modules, allowing for precise alignment and contact without manual intervention, enabling robotic insertion of warped modules into test sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a robotic arm is used for module insertion, then automation and productivity are improved, but the ability to handle warped modules deteriorates due to lack of adaptability
Solution Approach 1:
The patent introduces a mechanical intermediary system consisting of a pusher plate and alignment guides that mediate between the robotic arm and the memory module. The pusher plate applies distributed force to gradually align and insert warped modules, while alignment guides constrain the module's movement path. This intermediary mechanism enables the robotic arm to handle warped modules effectively without requiring high precision positioning.
2Manufacturing precision
If high precision robotic arm positioning is used, then insertion accuracy is improved, but system cost increases
Solution Approach 1:
The patent employs dynamic alignment guides and a movable pusher plate that adapt their position and orientation during the insertion process. The alignment guides can move to accommodate different module warpage patterns, and the pusher plate dynamically adjusts its insertion angle and force application points. This dynamic behavior allows the system to achieve high insertion accuracy with a less precise, lower-cost robotic arm.
3Adaptability or versatility
If manual insertion is used for warped modules, then adaptability is improved, but productivity and automation deteriorate
Solution Approach 1:
The patent implements a self-aligning mechanism where the alignment guides and pusher plate automatically adjust to the module's warpage characteristics during insertion. The system uses feedback from the module's physical interaction with the guides to self-correct alignment errors, eliminating the need for manual intervention while maintaining the adaptability that human operators provide. This enables automated handling of warped modules with high success rates.
Data Source
AI summary
A memory module test socket can accept modules with bent or warped printed-circuit boards (PCBs). A support plate is mounted above a Personal Computer (PC) motherboard by standoffs. An extender card fits through a slot in the support plate. The bottom edge of the extender card is plugged into a motherboard memory module socket on the motherboard. The top of the extender card has an extender socket that sits atop the support plate. End guides are mounted to the support plate and clamp down the extender socket. Funnel guides formed in the end guides have a funnel shape to guide ends of a memory module for better alignment when inserted into the extender socket. A pusher plate with a triangular guide or a perpendicular rod applies a perpendicular force on the middle of a warped memory module to align the middle to the extender socket during insertion.