Warped Substrate Transfer Using Oblique Alignment Loading
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Solution Overview
Problem
Substrates in substrate processing systems may exhibit warpage, which complicates accurate alignment and transfer, leading to potential positional displacement and particle generation during handling.
Innovation Solution
A method involving a transfer robot that obliquely mounts substrates in an alignment module, measuring eccentricity to estimate warpage, and correcting positional displacement based on this measurement to ensure accurate loading in subsequent modules.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a substrate with warpage is transferred using a conventional horizontal mounting method, then the transfer process is simple, but the substrate experiences positional displacement and particle generation due to warpage
Solution Approach 1:
The patent changes the mounting operation from a horizontal approach to an oblique downward movement, introducing a vertical dimension to the transfer path. This dimensional change allows the substrate to be mounted while accommodating its warpage, preventing positional displacement and particle generation without requiring complex additional equipment
2Manufacturing precision
If the substrate is mounted horizontally without considering warpage, then the mounting process is fast, but alignment precision deteriorates due to positional displacement
Solution Approach 1:
The patent performs preliminary measurement of substrate eccentricity before the mounting operation. By measuring the eccentricity and calculating the required correction amount in advance, the system prepares the corrected transfer path beforehand, ensuring alignment precision is maintained while minimizing additional time loss during the actual mounting process
3Object-generated harmful factors
If conventional transfer methods are used for substrates with warpage, then the transfer process is straightforward, but particle generation occurs due to improper handling of warped substrates
Solution Approach 1:
The patent replaces the conventional horizontal mechanical transfer path with an oblique downward transfer path. This mechanical substitution changes the relative motion between the transfer robot and substrate, allowing the substrate to be mounted in a manner that accommodates its warpage shape, thereby preventing particle generation while maintaining operational simplicity
Data Source
AI summary
A substrate transfer method includes (A) causing a transfer robot to hold a substrate and to load the substrate in an alignment module, and causing the transfer robot to mount the substrate on a stage of the alignment module based on the transfer robot moving past the stage of the alignment module; (B) causing the alignment module to measure an eccentricity of the substrate and estimating an amount of warpage of the substrate based on the measured eccentricity of the substrate; and (C) causing the substrate unloaded from the alignment module to be loaded in a different module based on the estimated amount of warpage of the substrate. The (A), (B), and (C) are performed in this order. In (A), the substrate is moved obliquely downward relative to a stage of the alignment module.