Warped Substrate Bonding with Rotary Flattening Alignment
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Solution Overview
Problem
Warped substrates pose alignment challenges during the bonding process due to differing expansion coefficients and unique warpage shapes, affecting the accuracy of wafer and carrier substrate alignment in semiconductor processes.
Innovation Solution
A bonding machine equipped with flattening devices and alignment units, featuring telescopic rotary motors and exhaust lines, which flatten and align warped substrates to improve accuracy by maintaining a flat surface and utilizing vacuum technology to ensure precise positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is directly aligned without flattening, then the alignment process is simpler and faster, but the alignment accuracy deteriorates due to warpage
Solution Approach 1:
The flattening unit performs preliminary flattening action on the substrate before the alignment process. The flattening unit presses against the substrate surface to correct warpage, ensuring the substrate is flat prior to alignment. This preliminary action eliminates the need for complex alignment compensation, thereby improving alignment accuracy without significantly increasing overall process complexity.
2Manufacturing precision
If the flattening unit rotates close to the substrate, then flattening effectiveness improves, but substrate abrasion increases
Solution Approach 1:
The flattening unit is designed to rotate during the flattening process rather than remaining stationary. This rotational motion allows the flattening unit to effectively press and flatten warped regions of the substrate while continuously changing contact points, thereby reducing localized abrasion. The dynamic rotation enables effective flattening without causing excessive wear to the substrate surface.
3Manufacturing precision
If the flattening unit moves down to flatten the substrate, then warpage correction improves, but the risk of substrate damage increases
Solution Approach 1:
The system incorporates feedback control where the flattening unit's downward movement is controlled based on real-time monitoring of substrate response. The flattening unit applies pressure to correct warpage, and the system adjusts the pressing force and duration based on substrate characteristics, preventing excessive force that could cause damage. This feedback mechanism ensures effective warpage correction while maintaining substrate integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively flattens and aligns warped substrates, enhancing the precision of the bonding process, thereby improving the efficiency and reliability of substrate alignment and bonding operations.
Implementation Method 1
a plurality of exhaust lines on the carrier surface of the carrier, wherein the exhaust lines are connected to the carrier surface of the carrier, and are located below the substrate to suck an inner side of the warped substrate
Data Source
AI summary
The disclosure is a bonding machine for warped substrates, which includes a first chamber, a second chamber, a pressing unit, a carrier and a plurality of flattening devices. The first chamber is configured to connect with the second chamber to define an enclosed space therebetween. The pressing unit is connected to the first chamber, and the carrier is connected to the second chamber. The pressing unit faces the carrier and is configured to bond the substrates placed on the carrier. The flattening devices are arranged on the carrier, and include a plurality of flattening units and a plurality of telescopic rotary motors. The flattening units are located around the substrate. The telescopic rotation motor is connected to and drives the flattening unit to rotate, move up and down to flatten the substrate placed on the carrier to improve the accuracy of aligning the substrate.