Watch Component Manufacturing Using Single Wafer Etching
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Solution Overview
Problem
The existing method for manufacturing watch components from micro-machinable materials, such as silicon, involves a complex and time-consuming release step that requires dissolving an intermediate silicon oxide layer, necessitating specialized equipment and prolonging the manufacturing process.
Innovation Solution
The method simplifies the manufacturing process by eliminating the need for a second support wafer, allowing the entire thickness of the micro-machinable material wafer to be etched and used directly to form the component, either by increasing the thickness of a single silicon wafer or by using a thin metallic lower layer that can be easily dissolved for release, thereby eliminating the need for a separate support wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a second support wafer and intermediate silicon oxide layer are used to stiffen the wafer and enable handling, then the wafer can be handled safely and processed during manufacturing, but the release step becomes complex and time-consuming requiring dissolution of the intermediate layer
Solution Approach 1:
The patent removes the second support wafer and intermediate silicon oxide layer from the manufacturing process. Instead of using a complex support structure that requires dissolution for release, the invention uses a single wafer with a metallic lower layer that simplifies the release step while maintaining sufficient mechanical strength during processing
Solution Approach 2:
The patent changes the material parameter of the lower layer from silicon oxide (requiring complex dissolution) to metal (easily removable). This parameter change transforms the release mechanism from chemical dissolution to simple mechanical or chemical removal, significantly reducing process complexity and time
2Reliability
If a second support wafer with intermediate layer is used, then the wafer can be handled without risk, but the manufacturing process requires specialized equipment and prolonged time
Solution Approach 1:
The invention extracts and eliminates the second support wafer and intermediate layer that cause manufacturing delays. The single wafer design with metallic lower layer maintains handling safety through alternative support mechanisms during processing, while eliminating the time-consuming dissolution step required by the traditional two-wafer approach
Solution Approach 2:
Instead of using a removable intermediate layer between two wafers that requires dissolution, the invention inverts the approach by using a single wafer where the metallic lower layer serves as both support and easily removable release layer, reversing the complexity from release to assembly
3Ease of manufacture
If the entire thickness of the micro-machinable material is etched to form the component, then the component can be directly obtained without support, but the wafer requires stiffening during processing
Solution Approach 1:
The patent changes the material parameter of the lower layer from silicon oxide to metal, which provides superior mechanical support during etching while being easily removable afterward. This parameter change enables the entire wafer thickness to be utilized for component formation while maintaining adequate stiffness during processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly simplifies the manufacturing process by eliminating the complex release step, reducing equipment requirements, and enabling the direct use of the micro-machinable material's entire thickness for component formation, resulting in a more efficient and cost-effective production method.
Implementation Method 1
The method simplifies the manufacturing process by eliminating the need for a second support wafer, allowing the entire thickness of the micro-machinable material wafer to be etched and used directly to form the component
Data Source
Figure 1a~1f
Figure 2a~3f
AI summary
A method for manufacturing a watch component (19; 29), characterized in that it comprises the following steps: • preparing (E11; E21) a wafer (11; 21) comprising a single plate (12; 22) comprising a component material, in particular silicon, diamond, quartz, sapphire, or ceramic, • optionally pre-coating the lower surface of said plate (22) with a lower layer (24), • etching (E12 to E14; E22 to E24) said plate (12; 22) of the wafer (11; 21) from its upper surface to form at least one watch component, • revealing (E15; E25) at least one watch component (19; 29) by removing a layer that served as a mask for the etching (E15; E25), • and optionally releasing (E26) said plate and the at least one etched watch component removal of the lower layer (24).