Water-Based Polyolefin Adhesive Composition for High-Temperature Bonding
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Solution Overview
Problem
Existing rubber-based adhesives for polyolefin substrates have poor adhesive strength at high temperatures, and water-based adhesives face challenges in achieving sufficient bonding without solvents.
Innovation Solution
A resin composition comprising an acid-modified polyolefin resin with specific melting points and a polyurethane resin in a specific ratio, enhancing adhesive strength at both room and high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If rubber-based adhesives are used to bond polyolefin substrate and skin material, then adhesive bonding is achieved, but adhesive strength deteriorates at high temperatures
Solution Approach 1:
The patent changes the chemical composition parameters of the adhesive by using acid-modified polyolefin resin with specific melting points (90°C or higher) combined with polyurethane resin in a specific ratio (20-100 parts by mass per 100 parts of acid-modified polyolefin resin). This parameter optimization enables the adhesive to maintain strength at high temperatures while achieving good bonding at room temperature.
Solution Approach 2:
The patent creates a composite adhesive material combining acid-modified polyolefin resin and polyurethane resin. This composite structure leverages the heat resistance of the acid-modified polyolefin and the bonding capability of the polyurethane to achieve both high-temperature stability and good adhesive strength.
2Object-affected harmful factors
If water-based adhesives are used without solvents, then environmental and hygiene requirements are met, but adhesive strength is insufficient
Solution Approach 1:
The patent changes the physical state parameters of the adhesive formulation by using water-based dispersion without organic solvents. The acid-modified polyolefin resin and polyurethane resin are dispersed in water to form a binder that achieves sufficient adhesive strength through proper composition rather than solvent-based penetration.
3Object-affected harmful factors
If water-based adhesive composition is used for bonding skin material to polyolefin substrate, then environmental benefits are achieved, but adhesive strength deteriorates at high temperatures
Solution Approach 1:
The patent optimizes the composition parameters by specifying that the acid-modified polyolefin resin must have a melting point of 90°C or higher and that the polyurethane resin content must be 20-100 parts by mass per 100 parts of acid-modified polyolefin resin. These parameter controls enable the water-based adhesive to maintain adequate strength at high temperatures while eliminating organic solvents.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides high adhesive strength at room temperature and maintains sufficient strength up to 180°C, improving bonding between polyolefin substrates and other materials.
Implementation Method 1
a method of laminating a skin material on such a polyolefin substrate is known to improve surface design, texture, and feel
Implementation Method 2
the acid-modified polyolefin resin (A) comprises an acid-modified polyolefin resin (a) having a melting point of 90°C or higher and an acid-modified polyolefin resin (b) having a melting point below 90°C
Data Source
AI summary
The present invention provides a resin composition that has high adhesive strength at room temperature and that has sufficient adhesive strength even at high temperatures. Specifically, the present invention provides a resin composition containing an acid-modified polyolefin resin (A) and a polyurethane resin (B), in which the content of the polyurethane resin (B) is 20 parts by mass or more and 100 parts by mass or less per 100 parts by mass of the acid-modified polyolefin resin (A), and in which the acid-modified polyolefin resin (A) contains an acid-modified polyolefin resin (a) having a melting point of 90°C or higher and an acid-modified polyolefin resin (b) having a melting point below 90°C.